RESIN COMPOSITION AND MOLDING MADE BY USING THE COMPOSITION

PURPOSE: To obtain a thermally reversibly crosslinkable resin composition which emits very little smoke in molding, is excellent in heat stability, does not form a crosslinked structure at the molding temperature and rapidly forms a crosslinked structure in the cooling and solidifying process after...

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Bibliographische Detailangaben
Hauptverfasser:	MIKAWA YASUHIRO, TAKOSHI HIROTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE: To obtain a thermally reversibly crosslinkable resin composition which emits very little smoke in molding, is excellent in heat stability, does not form a crosslinked structure at the molding temperature and rapidly forms a crosslinked structure in the cooling and solidifying process after molding by mixing a specified ethylene copolymer, a specified modified polyolefin and a reaction accelerator. CONSTITUTION: This resin composition contains 100 pts.wt. ethylene copolymer (a) containing as the constituent monomers ethylene and at least a radical- polymerizable acid anhydride, with the acid anhydride group content being 0.1-10wt.%; 0.1-30 pts.wt. modified polyolefin (b) obtained by reacting an unsaturated carboxylic acid-modified polyolefin with an aminoalcohol represented by the formula H2 N-R-OH (wherein R is H, a 1-18C chain or cyclic alkylene, arylene or aralkylene); and 0.001-20 pts.wt. reaction accelerator (c).