FORMATION METHOD OF VIA HOLE AND MANUFACTURE OF MULTILAYER WIRING BOARD AS WELL AS MULTILAYER WIRING BOARD AND ELECTRONIC APPARATUS
PURPOSE:To reduce the interlayer connection resistance of a wiring layer formed on a resin thin-film multilayer wiring board by a method wherein, by utilizing the laser etching threshold value of a metal forming a barrier layer and of a metal forming the wiring layer, the barrier layer formed betwee...
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| creator | SHIMIZU KANAE TSUKAHIRO KOUJI |
| description | PURPOSE:To reduce the interlayer connection resistance of a wiring layer formed on a resin thin-film multilayer wiring board by a method wherein, by utilizing the laser etching threshold value of a metal forming a barrier layer and of a metal forming the wiring layer, the barrier layer formed between a resin thin film and the wiring layer is removed simultaneously. CONSTITUTION:A sample 5 in which a copper film 2 and a chromium film 3 have been laminated and formed sequentially on a glass substrate 1 by using a sputtering method and in which a polyimide film 4 has been formed on them is placed on an X-Y stage for a laser irradiation apparatus. A mask 7 in which light-transmitting regions 9 have been formed is placed on the sample 5, a laser at an energy intensity of 0.5 to 0.55J/cm .pulse is irradiated from a laser oscillator 8 by utilizing the difference in a laser etching threshold value between chromium anal copper. As a result, the chromium film 3 inside the via holes 9 can be removed completely without damaging the copper wiring layer 2. Consequently, an upper wiring layer and a lower wiring layer in the via holes are connected directly, and their interlayer connection resistance is reduced. |
| format | Patent |
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CONSTITUTION:A sample 5 in which a copper film 2 and a chromium film 3 have been laminated and formed sequentially on a glass substrate 1 by using a sputtering method and in which a polyimide film 4 has been formed on them is placed on an X-Y stage for a laser irradiation apparatus. A mask 7 in which light-transmitting regions 9 have been formed is placed on the sample 5, a laser at an energy intensity of 0.5 to 0.55J/cm .pulse is irradiated from a laser oscillator 8 by utilizing the difference in a laser etching threshold value between chromium anal copper. As a result, the chromium film 3 inside the via holes 9 can be removed completely without damaging the copper wiring layer 2. Consequently, an upper wiring layer and a lower wiring layer in the via holes are connected directly, and their interlayer connection resistance is reduced.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950214&DB=EPODOC&CC=JP&NR=H0745949A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950214&DB=EPODOC&CC=JP&NR=H0745949A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIMIZU KANAE</creatorcontrib><creatorcontrib>TSUKAHIRO KOUJI</creatorcontrib><title>FORMATION METHOD OF VIA HOLE AND MANUFACTURE OF MULTILAYER WIRING BOARD AS WELL AS MULTILAYER WIRING BOARD AND ELECTRONIC APPARATUS</title><description>PURPOSE:To reduce the interlayer connection resistance of a wiring layer formed on a resin thin-film multilayer wiring board by a method wherein, by utilizing the laser etching threshold value of a metal forming a barrier layer and of a metal forming the wiring layer, the barrier layer formed between a resin thin film and the wiring layer is removed simultaneously. CONSTITUTION:A sample 5 in which a copper film 2 and a chromium film 3 have been laminated and formed sequentially on a glass substrate 1 by using a sputtering method and in which a polyimide film 4 has been formed on them is placed on an X-Y stage for a laser irradiation apparatus. A mask 7 in which light-transmitting regions 9 have been formed is placed on the sample 5, a laser at an energy intensity of 0.5 to 0.55J/cm .pulse is irradiated from a laser oscillator 8 by utilizing the difference in a laser etching threshold value between chromium anal copper. As a result, the chromium film 3 inside the via holes 9 can be removed completely without damaging the copper wiring layer 2. Consequently, an upper wiring layer and a lower wiring layer in the via holes are connected directly, and their interlayer connection resistance is reduced.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjDsKwkAUANNYiHqHdwFBMCIpXzZv3ZX9hM1bg1UIslaigXgDL64BW8Fqihlmnr2kDxZZeweWWPkKvISTRlDeEKCrwKKLEgXHQJOz0bA2eKYArQ7aHaD0GCrABloyZuLP5HMjQ4KDd1oA1jUG5Ngss9m1v41p9eUiA0ks1DoNjy6NQ39J9_TsjrXa7PNdkRe4_SN5A4iqPK4</recordid><startdate>19950214</startdate><enddate>19950214</enddate><creator>SHIMIZU KANAE</creator><creator>TSUKAHIRO KOUJI</creator><scope>EVB</scope></search><sort><creationdate>19950214</creationdate><title>FORMATION METHOD OF VIA HOLE AND MANUFACTURE OF MULTILAYER WIRING BOARD AS WELL AS MULTILAYER WIRING BOARD AND ELECTRONIC APPARATUS</title><author>SHIMIZU KANAE ; TSUKAHIRO KOUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0745949A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMIZU KANAE</creatorcontrib><creatorcontrib>TSUKAHIRO KOUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIMIZU KANAE</au><au>TSUKAHIRO KOUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FORMATION METHOD OF VIA HOLE AND MANUFACTURE OF MULTILAYER WIRING BOARD AS WELL AS MULTILAYER WIRING BOARD AND ELECTRONIC APPARATUS</title><date>1995-02-14</date><risdate>1995</risdate><abstract>PURPOSE:To reduce the interlayer connection resistance of a wiring layer formed on a resin thin-film multilayer wiring board by a method wherein, by utilizing the laser etching threshold value of a metal forming a barrier layer and of a metal forming the wiring layer, the barrier layer formed between a resin thin film and the wiring layer is removed simultaneously. CONSTITUTION:A sample 5 in which a copper film 2 and a chromium film 3 have been laminated and formed sequentially on a glass substrate 1 by using a sputtering method and in which a polyimide film 4 has been formed on them is placed on an X-Y stage for a laser irradiation apparatus. A mask 7 in which light-transmitting regions 9 have been formed is placed on the sample 5, a laser at an energy intensity of 0.5 to 0.55J/cm .pulse is irradiated from a laser oscillator 8 by utilizing the difference in a laser etching threshold value between chromium anal copper. As a result, the chromium film 3 inside the via holes 9 can be removed completely without damaging the copper wiring layer 2. Consequently, an upper wiring layer and a lower wiring layer in the via holes are connected directly, and their interlayer connection resistance is reduced.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | FORMATION METHOD OF VIA HOLE AND MANUFACTURE OF MULTILAYER WIRING BOARD AS WELL AS MULTILAYER WIRING BOARD AND ELECTRONIC APPARATUS |
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