SEPARATING AND RECOVERING METHOD FOR COPPER FROM WASTE MATERIAL CONTAINING COPPER

PURPOSE:To separate and to remove copper as a high quality copper oxide from the waste material containing copper. CONSTITUTION:The waste material of the copper-plated laminate substrate and the printing circuit boad is immersed in the copper chloride solution discharged as the surplus liq. for rege...

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Bibliographische Detailangaben
Hauptverfasser: UCHIDA TATSUYA, HIRATSUKA TSUGUHIKO, SUEMITSU TOSHIO, SAKAI KANGO, MASUYAMA TOKUYUKI, ISHIMARU OSAMU
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To separate and to remove copper as a high quality copper oxide from the waste material containing copper. CONSTITUTION:The waste material of the copper-plated laminate substrate and the printing circuit boad is immersed in the copper chloride solution discharged as the surplus liq. for regeneration from the circuit forming stage of the printing circuit board to separate a copper component from the waste material. The obtained copper chloride soln. is concentrated, and exposed to high temperature atmosphere in a roasting furnace to decompose by heat to the copper oxide and gaseous hydrogen chloride. The copper oxide and the gaseous hydrogen chloride are introduced to a cyclone, a cooling tower and an electrostatic precipitator, the separated high temp. waste gas is introduced to the concentrating tower while recovering the copper oxide as powder. The gaseous hydrogen chloride which is subjected to heat exchange a concentrating tower and cooled is recovered as a hydrochloric acid soln. in a hydrochloric acid recovering tower. The recovered copper oxide powder, as it is, is used as the starting material base stock of a copper foil, etc., or reused as the starting material of an electrolytic copper plating liq. or an electroless copper plating liq., and the hydrochloric acid soln. obtained in a hydrochloric acid recovering stage can be reused at the circuit forming stage, etc., of the printing circuit board. The substrate waste material after dissolving copper is pulverized, and can be reused as the filler, etc., of the copper-plated laminate substrate.