CIRCUIT BOARD MOUNTING DEVICE AND REMOVING DEVICE FOR PLATING
PURPOSE:To automate mounting and dismounting of circuit boards to racks for plating in plating treatment of printed circuit boards, etc. CONSTITUTION:The racks for plating which are formed by assembling a pair of vertical frames and horizontal frames, are disposed with long planar clamping members a...
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| creator | KOBAYASHI TAKESHI ARAKI KAZUTO KATOGI YASUO HOSOYA NOBUO |
| description | PURPOSE:To automate mounting and dismounting of circuit boards to racks for plating in plating treatment of printed circuit boards, etc. CONSTITUTION:The racks for plating which are formed by assembling a pair of vertical frames and horizontal frames, are disposed with long planar clamping members along the vertical frames and clamp the edges of the circuit boards in the spacings between the clamping members and the vertical frames are used. The circuit boards are aligned by stationary guides 12g, moving guides 12h, stoppers 12i and moving stoppers 12j on many rollers 12b of a circuit board aligning section 12. The circuit boards are transferred to a circuit board mounting section 13 by suction pads 12d. The racks are taken-in by a lifting conveyer 13b of the circuit board mounting section 13. The racks are held by a stationary rack opening/closing device 131 and a moving rack opening/closing device 132, by which the spacings between the vertical frames of the racks and the clamping members are opened and closed. The circuit boards from the circuit board aligning section 12 are inserted and clamped in the spacings between the vertical frames and the clamping members. The circuit boards subjected to the plating treatment are removed by the devices mutually making reverse operations. |
| format | Patent |
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The circuit boards are aligned by stationary guides 12g, moving guides 12h, stoppers 12i and moving stoppers 12j on many rollers 12b of a circuit board aligning section 12. The circuit boards are transferred to a circuit board mounting section 13 by suction pads 12d. The racks are taken-in by a lifting conveyer 13b of the circuit board mounting section 13. The racks are held by a stationary rack opening/closing device 131 and a moving rack opening/closing device 132, by which the spacings between the vertical frames of the racks and the clamping members are opened and closed. The circuit boards from the circuit board aligning section 12 are inserted and clamped in the spacings between the vertical frames and the clamping members. The circuit boards subjected to the plating treatment are removed by the devices mutually making reverse operations.</description><edition>6</edition><language>eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19951205&DB=EPODOC&CC=JP&NR=H07316885A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19951205&DB=EPODOC&CC=JP&NR=H07316885A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOBAYASHI TAKESHI</creatorcontrib><creatorcontrib>ARAKI KAZUTO</creatorcontrib><creatorcontrib>KATOGI YASUO</creatorcontrib><creatorcontrib>HOSOYA NOBUO</creatorcontrib><title>CIRCUIT BOARD MOUNTING DEVICE AND REMOVING DEVICE FOR PLATING</title><description>PURPOSE:To automate mounting and dismounting of circuit boards to racks for plating in plating treatment of printed circuit boards, etc. CONSTITUTION:The racks for plating which are formed by assembling a pair of vertical frames and horizontal frames, are disposed with long planar clamping members along the vertical frames and clamp the edges of the circuit boards in the spacings between the clamping members and the vertical frames are used. The circuit boards are aligned by stationary guides 12g, moving guides 12h, stoppers 12i and moving stoppers 12j on many rollers 12b of a circuit board aligning section 12. The circuit boards are transferred to a circuit board mounting section 13 by suction pads 12d. The racks are taken-in by a lifting conveyer 13b of the circuit board mounting section 13. The racks are held by a stationary rack opening/closing device 131 and a moving rack opening/closing device 132, by which the spacings between the vertical frames of the racks and the clamping members are opened and closed. The circuit boards from the circuit board aligning section 12 are inserted and clamped in the spacings between the vertical frames and the clamping members. 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The circuit boards are aligned by stationary guides 12g, moving guides 12h, stoppers 12i and moving stoppers 12j on many rollers 12b of a circuit board aligning section 12. The circuit boards are transferred to a circuit board mounting section 13 by suction pads 12d. The racks are taken-in by a lifting conveyer 13b of the circuit board mounting section 13. The racks are held by a stationary rack opening/closing device 131 and a moving rack opening/closing device 132, by which the spacings between the vertical frames of the racks and the clamping members are opened and closed. The circuit boards from the circuit board aligning section 12 are inserted and clamped in the spacings between the vertical frames and the clamping members. The circuit boards subjected to the plating treatment are removed by the devices mutually making reverse operations.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | CIRCUIT BOARD MOUNTING DEVICE AND REMOVING DEVICE FOR PLATING |
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