WIRE FORM MEASURING DEVICE OF BONDING DEVICE

PURPOSE:To provide a form measuring device that is capable of measuring the wire form of wire bonding. CONSTITUTION:Light emitted from a light source 22 passes through a filter 24, a lens 26 and a slit 28 and illuminates a wire 16 which bonds a lead 14 to an electrode pad located on a die. The light...

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Bibliographische Detailangaben

1. Verfasser:	SANADA TOMOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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