WIRE FORM MEASURING DEVICE OF BONDING DEVICE

PURPOSE:To provide a form measuring device that is capable of measuring the wire form of wire bonding. CONSTITUTION:Light emitted from a light source 22 passes through a filter 24, a lens 26 and a slit 28 and illuminates a wire 16 which bonds a lead 14 to an electrode pad located on a die. The light...

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1. Verfasser:	SANADA TOMOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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creator	SANADA TOMOHIRO
description	PURPOSE:To provide a form measuring device that is capable of measuring the wire form of wire bonding. CONSTITUTION:Light emitted from a light source 22 passes through a filter 24, a lens 26 and a slit 28 and illuminates a wire 16 which bonds a lead 14 to an electrode pad located on a die. The light reflected by the wire 16 impinges on a CCD camera 30 via a slit 32. The form 34 of the wire 16 that is captured by the CCD camera 30 is compared with a reference form 36, a control limit form 38, and a limit form 40, and is fed back to a capillary controller 19 if exceeding the range of the control limit form 38, while when it does not exceed the range of the control limit form 38, the process is continued. When the form 34 exceeds the range of the limit form 40, driving of a bonding device is stopped. Disconnection of the wire 16 can thus be prevented.
format	Patent
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CONSTITUTION:Light emitted from a light source 22 passes through a filter 24, a lens 26 and a slit 28 and illuminates a wire 16 which bonds a lead 14 to an electrode pad located on a die. The light reflected by the wire 16 impinges on a CCD camera 30 via a slit 32. The form 34 of the wire 16 that is captured by the CCD camera 30 is compared with a reference form 36, a control limit form 38, and a limit form 40, and is fed back to a capillary controller 19 if exceeding the range of the control limit form 38, while when it does not exceed the range of the control limit form 38, the process is continued. When the form 34 exceeds the range of the limit form 40, driving of a bonding device is stopped. 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Disconnection of the wire 16 can thus be prevented.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJ9wxyVXDzD_JV8HV1DA4N8vRzV3BxDfN0dlXwd1Nw8vdzQYjwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAPA3NjQ0MDIxNHY2LUAAB-syUF</recordid><startdate>19951128</startdate><enddate>19951128</enddate><creator>SANADA TOMOHIRO</creator><scope>EVB</scope></search><sort><creationdate>19951128</creationdate><title>WIRE FORM MEASURING DEVICE OF BONDING DEVICE</title><author>SANADA TOMOHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH07311024A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>IMAGE DATA PROCESSING OR GENERATION, IN GENERAL</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SANADA TOMOHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SANADA TOMOHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRE FORM MEASURING DEVICE OF BONDING DEVICE</title><date>1995-11-28</date><risdate>1995</risdate><abstract>PURPOSE:To provide a form measuring device that is capable of measuring the wire form of wire bonding. CONSTITUTION:Light emitted from a light source 22 passes through a filter 24, a lens 26 and a slit 28 and illuminates a wire 16 which bonds a lead 14 to an electrode pad located on a die. The light reflected by the wire 16 impinges on a CCD camera 30 via a slit 32. The form 34 of the wire 16 that is captured by the CCD camera 30 is compared with a reference form 36, a control limit form 38, and a limit form 40, and is fed back to a capillary controller 19 if exceeding the range of the control limit form 38, while when it does not exceed the range of the control limit form 38, the process is continued. When the form 34 exceeds the range of the limit form 40, driving of a bonding device is stopped. Disconnection of the wire 16 can thus be prevented.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
title	WIRE FORM MEASURING DEVICE OF BONDING DEVICE
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