HEAT TREATMENT DEVICE

PURPOSE:To provide a heat treatment device where a temperature measuring thermocouple which measures the temperature of a semiconductor wafer can easily be replaced. CONSTITUTION:Three conduits, a first, a second, and a third conduit, 50, 51, and 52, are inserted into a reaction tube 20 through the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SASAKI KIYOHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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