MOLD
PURPOSE:To keep the curing temp. distribution of the resin in a mold cavity constant by providing a cooling tank at the position of coming into contact with a mold and arranging a plurality of electronic coolers having self-controllability in the vicinity of the mold cavity and providing the radiati...
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| creator | SAKAE KATSUHIKO |
| description | PURPOSE:To keep the curing temp. distribution of the resin in a mold cavity constant by providing a cooling tank at the position of coming into contact with a mold and arranging a plurality of electronic coolers having self-controllability in the vicinity of the mold cavity and providing the radiation parts of the electronic coolers in the cooling tank. CONSTITUTION:A cooling tank 4 is arranged to the upper part of a mold 1 and the endothermic parts 8 of electronic coolers are provided in the vicinity of a cavity 2 at places requiring local cooling and the radiation parts 7 thereof are immersed in the cooling water received in the cooling tank 4. Each of the electronic coolers is formed as one unit by connecting several thermocouple elements 14 and these thermocouple elements 14 are connected to conductors and semiconductors of a different kind to constitute closed loop to perform radiation and heat absorption by Peltier effect. In order to provide self-controllability to each of the electronic coolers against temp., a part of each of the endothermic parts 8 is constituted of a temp.-sensitive part 13 suddenly increased in resistance at certain temp. by a closed circuit. Therefore, at the time of predetermined temp. or higher, cooling capacity is increased to hold constant temp. distribution. As a result, the curing temp. distribution of a resin can be kept constant. |
| format | Patent |
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CONSTITUTION:A cooling tank 4 is arranged to the upper part of a mold 1 and the endothermic parts 8 of electronic coolers are provided in the vicinity of a cavity 2 at places requiring local cooling and the radiation parts 7 thereof are immersed in the cooling water received in the cooling tank 4. Each of the electronic coolers is formed as one unit by connecting several thermocouple elements 14 and these thermocouple elements 14 are connected to conductors and semiconductors of a different kind to constitute closed loop to perform radiation and heat absorption by Peltier effect. In order to provide self-controllability to each of the electronic coolers against temp., a part of each of the endothermic parts 8 is constituted of a temp.-sensitive part 13 suddenly increased in resistance at certain temp. by a closed circuit. Therefore, at the time of predetermined temp. or higher, cooling capacity is increased to hold constant temp. distribution. As a result, the curing temp. distribution of a resin can be kept constant.</description><edition>6</edition><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; PERFORMING OPERATIONS ; PUNCHING METAL ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL ; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950106&DB=EPODOC&CC=JP&NR=H071457A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950106&DB=EPODOC&CC=JP&NR=H071457A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAE KATSUHIKO</creatorcontrib><title>MOLD</title><description>PURPOSE:To keep the curing temp. distribution of the resin in a mold cavity constant by providing a cooling tank at the position of coming into contact with a mold and arranging a plurality of electronic coolers having self-controllability in the vicinity of the mold cavity and providing the radiation parts of the electronic coolers in the cooling tank. CONSTITUTION:A cooling tank 4 is arranged to the upper part of a mold 1 and the endothermic parts 8 of electronic coolers are provided in the vicinity of a cavity 2 at places requiring local cooling and the radiation parts 7 thereof are immersed in the cooling water received in the cooling tank 4. Each of the electronic coolers is formed as one unit by connecting several thermocouple elements 14 and these thermocouple elements 14 are connected to conductors and semiconductors of a different kind to constitute closed loop to perform radiation and heat absorption by Peltier effect. In order to provide self-controllability to each of the electronic coolers against temp., a part of each of the endothermic parts 8 is constituted of a temp.-sensitive part 13 suddenly increased in resistance at certain temp. by a closed circuit. Therefore, at the time of predetermined temp. or higher, cooling capacity is increased to hold constant temp. distribution. As a result, the curing temp. distribution of a resin can be kept constant.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PUNCHING METAL</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><subject>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGDx9fdx4WFgTUvMKU7lhdLcDPJuriHOHrqpBfnxqcUFicmpeakl8V4BHgbmhiam5o7GhFUAAFdZGYU</recordid><startdate>19950106</startdate><enddate>19950106</enddate><creator>SAKAE KATSUHIKO</creator><scope>EVB</scope></search><sort><creationdate>19950106</creationdate><title>MOLD</title><author>SAKAE KATSUHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH071457A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PUNCHING METAL</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><topic>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAE KATSUHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAE KATSUHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOLD</title><date>1995-01-06</date><risdate>1995</risdate><abstract>PURPOSE:To keep the curing temp. distribution of the resin in a mold cavity constant by providing a cooling tank at the position of coming into contact with a mold and arranging a plurality of electronic coolers having self-controllability in the vicinity of the mold cavity and providing the radiation parts of the electronic coolers in the cooling tank. CONSTITUTION:A cooling tank 4 is arranged to the upper part of a mold 1 and the endothermic parts 8 of electronic coolers are provided in the vicinity of a cavity 2 at places requiring local cooling and the radiation parts 7 thereof are immersed in the cooling water received in the cooling tank 4. Each of the electronic coolers is formed as one unit by connecting several thermocouple elements 14 and these thermocouple elements 14 are connected to conductors and semiconductors of a different kind to constitute closed loop to perform radiation and heat absorption by Peltier effect. In order to provide self-controllability to each of the electronic coolers against temp., a part of each of the endothermic parts 8 is constituted of a temp.-sensitive part 13 suddenly increased in resistance at certain temp. by a closed circuit. Therefore, at the time of predetermined temp. or higher, cooling capacity is increased to hold constant temp. distribution. As a result, the curing temp. distribution of a resin can be kept constant.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL |
| title | MOLD |
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