PHOTOSENSITIVE RESIN COMPOSITION
PURPOSE:To prevent the transfer of the leuco compound as dyestuff fore cursor to an adbesive layer by forming a photosensitive resin composition mainly from a microcapsule containing the leuco compound having the ethylenic unsaturated bond, photopolymerization starting agent, and tne leuco compound...
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| creator | KASHIO SHIGETORA TANAKA SHINJI |
| description | PURPOSE:To prevent the transfer of the leuco compound as dyestuff fore cursor to an adbesive layer by forming a photosensitive resin composition mainly from a microcapsule containing the leuco compound having the ethylenic unsaturated bond, photopolymerization starting agent, and tne leuco compound as dyestuff forecursor. CONSTITUTION:A photosensitive reisn composition mainly consists of a microcapsule containing the compound having the ethylenic unsaturated bond, photopolymerization starting agent, and the leuco compound as dyestuf precursor. The microcapsule containing the leuco compound develops color when light is irradiated. The substance for forming a capsule wall preferably polyvinyl alcohol. The polyvinyl alcohol preferably possesses the sapcnification degree of 60% or more, and more preferably 75% or more. The dimension of the capsule is preferably 0.01-25mum in diameter, and more preferably 0.1-20mum. Since the leuco compound does not tansfer to an adhesive layer for joining the photosensitive layer and a substrate, the color development of the adhesive layer is prevented. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0713330A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0713330A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0713330A3</originalsourceid><addsrcrecordid>eNrjZFAI8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvxMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAPA3NDY2NjA0djIpQAAOwwIiI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PHOTOSENSITIVE RESIN COMPOSITION</title><source>esp@cenet</source><creator>KASHIO SHIGETORA ; TANAKA SHINJI</creator><creatorcontrib>KASHIO SHIGETORA ; TANAKA SHINJI</creatorcontrib><description>PURPOSE:To prevent the transfer of the leuco compound as dyestuff fore cursor to an adbesive layer by forming a photosensitive resin composition mainly from a microcapsule containing the leuco compound having the ethylenic unsaturated bond, photopolymerization starting agent, and tne leuco compound as dyestuff forecursor. CONSTITUTION:A photosensitive reisn composition mainly consists of a microcapsule containing the compound having the ethylenic unsaturated bond, photopolymerization starting agent, and the leuco compound as dyestuf precursor. The microcapsule containing the leuco compound develops color when light is irradiated. The substance for forming a capsule wall preferably polyvinyl alcohol. The polyvinyl alcohol preferably possesses the sapcnification degree of 60% or more, and more preferably 75% or more. The dimension of the capsule is preferably 0.01-25mum in diameter, and more preferably 0.1-20mum. Since the leuco compound does not tansfer to an adhesive layer for joining the photosensitive layer and a substrate, the color development of the adhesive layer is prevented.</description><edition>6</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950117&DB=EPODOC&CC=JP&NR=H0713330A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950117&DB=EPODOC&CC=JP&NR=H0713330A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KASHIO SHIGETORA</creatorcontrib><creatorcontrib>TANAKA SHINJI</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION</title><description>PURPOSE:To prevent the transfer of the leuco compound as dyestuff fore cursor to an adbesive layer by forming a photosensitive resin composition mainly from a microcapsule containing the leuco compound having the ethylenic unsaturated bond, photopolymerization starting agent, and tne leuco compound as dyestuff forecursor. CONSTITUTION:A photosensitive reisn composition mainly consists of a microcapsule containing the compound having the ethylenic unsaturated bond, photopolymerization starting agent, and the leuco compound as dyestuf precursor. The microcapsule containing the leuco compound develops color when light is irradiated. The substance for forming a capsule wall preferably polyvinyl alcohol. The polyvinyl alcohol preferably possesses the sapcnification degree of 60% or more, and more preferably 75% or more. The dimension of the capsule is preferably 0.01-25mum in diameter, and more preferably 0.1-20mum. Since the leuco compound does not tansfer to an adhesive layer for joining the photosensitive layer and a substrate, the color development of the adhesive layer is prevented.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAI8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvxMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAPA3NDY2NjA0djIpQAAOwwIiI</recordid><startdate>19950117</startdate><enddate>19950117</enddate><creator>KASHIO SHIGETORA</creator><creator>TANAKA SHINJI</creator><scope>EVB</scope></search><sort><creationdate>19950117</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION</title><author>KASHIO SHIGETORA ; TANAKA SHINJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0713330A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KASHIO SHIGETORA</creatorcontrib><creatorcontrib>TANAKA SHINJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KASHIO SHIGETORA</au><au>TANAKA SHINJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION</title><date>1995-01-17</date><risdate>1995</risdate><abstract>PURPOSE:To prevent the transfer of the leuco compound as dyestuff fore cursor to an adbesive layer by forming a photosensitive resin composition mainly from a microcapsule containing the leuco compound having the ethylenic unsaturated bond, photopolymerization starting agent, and tne leuco compound as dyestuff forecursor. CONSTITUTION:A photosensitive reisn composition mainly consists of a microcapsule containing the compound having the ethylenic unsaturated bond, photopolymerization starting agent, and the leuco compound as dyestuf precursor. The microcapsule containing the leuco compound develops color when light is irradiated. The substance for forming a capsule wall preferably polyvinyl alcohol. The polyvinyl alcohol preferably possesses the sapcnification degree of 60% or more, and more preferably 75% or more. The dimension of the capsule is preferably 0.01-25mum in diameter, and more preferably 0.1-20mum. Since the leuco compound does not tansfer to an adhesive layer for joining the photosensitive layer and a substrate, the color development of the adhesive layer is prevented.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | PHOTOSENSITIVE RESIN COMPOSITION |
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