SURFACE TREATMENT OF COPPER

SURFACE TREATMENT OF COPPER

PURPOSE:To provide a method of treating a copper surface to form a uniform layer capable of reliable adhesion to resin. CONSTITUTION:A copper surface is treated by oxidation, reduction and nickel plating to enhance its adhesion to resin and prevent haloing. The individual treatment steps are control...

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Hauptverfasser: NOHARA SHOZO, KAGIWADA HIKARI, FURUKAWA KIYONORI
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator NOHARA SHOZO
KAGIWADA HIKARI
FURUKAWA KIYONORI
description PURPOSE:To provide a method of treating a copper surface to form a uniform layer capable of reliable adhesion to resin. CONSTITUTION:A copper surface is treated by oxidation, reduction and nickel plating to enhance its adhesion to resin and prevent haloing. The individual treatment steps are controlled while the potential of the copper surface is monitored. Each step is finished when the surface potential reaches a predetermined level. To this end, a potentiometer 10 is provided for each bath 11 so that it may be connected between a substrate 9 and an electrode 13 when the substrate is immersed in the bath containing a solution 12. This arrangement enables control of different conditions of chemical solution for different treatments by monitoring the respective surface potentials during oxidation, reduction and plating. Therefore, it is possible to carried out uniform treatment of a copper surface.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0637446A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0637446A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0637446A3</originalsourceid><addsrcrecordid>eNrjZJAODg1yc3R2VQgJcnUM8XX1C1Hwd1Nw9g8IcA3iYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgEeBmbG5iYmZo7GRCgBABlIIFk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SURFACE TREATMENT OF COPPER</title><source>esp@cenet</source><creator>NOHARA SHOZO ; KAGIWADA HIKARI ; FURUKAWA KIYONORI</creator><creatorcontrib>NOHARA SHOZO ; KAGIWADA HIKARI ; FURUKAWA KIYONORI</creatorcontrib><description>PURPOSE:To provide a method of treating a copper surface to form a uniform layer capable of reliable adhesion to resin. CONSTITUTION:A copper surface is treated by oxidation, reduction and nickel plating to enhance its adhesion to resin and prevent haloing. The individual treatment steps are controlled while the potential of the copper surface is monitored. Each step is finished when the surface potential reaches a predetermined level. To this end, a potentiometer 10 is provided for each bath 11 so that it may be connected between a substrate 9 and an electrode 13 when the substrate is immersed in the bath containing a solution 12. This arrangement enables control of different conditions of chemical solution for different treatments by monitoring the respective surface potentials during oxidation, reduction and plating. Therefore, it is possible to carried out uniform treatment of a copper surface.</description><edition>5</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19940210&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0637446A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19940210&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0637446A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NOHARA SHOZO</creatorcontrib><creatorcontrib>KAGIWADA HIKARI</creatorcontrib><creatorcontrib>FURUKAWA KIYONORI</creatorcontrib><title>SURFACE TREATMENT OF COPPER</title><description>PURPOSE:To provide a method of treating a copper surface to form a uniform layer capable of reliable adhesion to resin. CONSTITUTION:A copper surface is treated by oxidation, reduction and nickel plating to enhance its adhesion to resin and prevent haloing. The individual treatment steps are controlled while the potential of the copper surface is monitored. Each step is finished when the surface potential reaches a predetermined level. To this end, a potentiometer 10 is provided for each bath 11 so that it may be connected between a substrate 9 and an electrode 13 when the substrate is immersed in the bath containing a solution 12. This arrangement enables control of different conditions of chemical solution for different treatments by monitoring the respective surface potentials during oxidation, reduction and plating. Therefore, it is possible to carried out uniform treatment of a copper surface.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAODg1yc3R2VQgJcnUM8XX1C1Hwd1Nw9g8IcA3iYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgEeBmbG5iYmZo7GRCgBABlIIFk</recordid><startdate>19940210</startdate><enddate>19940210</enddate><creator>NOHARA SHOZO</creator><creator>KAGIWADA HIKARI</creator><creator>FURUKAWA KIYONORI</creator><scope>EVB</scope></search><sort><creationdate>19940210</creationdate><title>SURFACE TREATMENT OF COPPER</title><author>NOHARA SHOZO ; KAGIWADA HIKARI ; FURUKAWA KIYONORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0637446A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>NOHARA SHOZO</creatorcontrib><creatorcontrib>KAGIWADA HIKARI</creatorcontrib><creatorcontrib>FURUKAWA KIYONORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NOHARA SHOZO</au><au>KAGIWADA HIKARI</au><au>FURUKAWA KIYONORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE TREATMENT OF COPPER</title><date>1994-02-10</date><risdate>1994</risdate><abstract>PURPOSE:To provide a method of treating a copper surface to form a uniform layer capable of reliable adhesion to resin. CONSTITUTION:A copper surface is treated by oxidation, reduction and nickel plating to enhance its adhesion to resin and prevent haloing. The individual treatment steps are controlled while the potential of the copper surface is monitored. Each step is finished when the surface potential reaches a predetermined level. To this end, a potentiometer 10 is provided for each bath 11 so that it may be connected between a substrate 9 and an electrode 13 when the substrate is immersed in the bath containing a solution 12. This arrangement enables control of different conditions of chemical solution for different treatments by monitoring the respective surface potentials during oxidation, reduction and plating. Therefore, it is possible to carried out uniform treatment of a copper surface.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SURFACE TREATMENT OF COPPER
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T16%3A08%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NOHARA%20SHOZO&rft.date=1994-02-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH0637446A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true