CONDUCTIVE PASTE
PURPOSE:To obtain a conductive paste which has a high conductivity and an excellent economy, and can improve a short circuit between electrodes and between wirings, when an electric field is applied in the ambiance of a high temperature and a high humidity, by including an almost spherical form of m...
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| creator | YAMANA SHOZO KUWASHIMA HIDEJI |
| description | PURPOSE:To obtain a conductive paste which has a high conductivity and an excellent economy, and can improve a short circuit between electrodes and between wirings, when an electric field is applied in the ambiance of a high temperature and a high humidity, by including an almost spherical form of minute particles, a flake form silver powder, a copper powder, and a nitrophenyl hydrazine genus, to the conductive paste. CONSTITUTION:This conductive paste includes an almost spherical form of minute particles with the particle size less than 30mum, a flake form silver powder, a copper powder, and a nitrophenyl hydrazine genus. The ratio of the copper powder, the almost spherical form of minute particles, and the flake form silver powder is favorable to be 1:20 to 1:1 in respect of the conductivity. As the nitrophenyl hydrazine genus, it is favorable to use one sort or a mixture of plural sorts of 3-nitrophenyl hydrazine and 3, 5-dinitrophenyl hydrazines. The amount of the nitrophenyl hydrazine genus is favorable to be 0.05 to 2.0wt% to the solid component of the conductive paste in respect of the migration and the economy. |
| format | Patent |
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CONSTITUTION:This conductive paste includes an almost spherical form of minute particles with the particle size less than 30mum, a flake form silver powder, a copper powder, and a nitrophenyl hydrazine genus. The ratio of the copper powder, the almost spherical form of minute particles, and the flake form silver powder is favorable to be 1:20 to 1:1 in respect of the conductivity. As the nitrophenyl hydrazine genus, it is favorable to use one sort or a mixture of plural sorts of 3-nitrophenyl hydrazine and 3, 5-dinitrophenyl hydrazines. The amount of the nitrophenyl hydrazine genus is favorable to be 0.05 to 2.0wt% to the solid component of the conductive paste in respect of the migration and the economy.</description><edition>5</edition><language>eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19941222&DB=EPODOC&CC=JP&NR=H06349320A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19941222&DB=EPODOC&CC=JP&NR=H06349320A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMANA SHOZO</creatorcontrib><creatorcontrib>KUWASHIMA HIDEJI</creatorcontrib><title>CONDUCTIVE PASTE</title><description>PURPOSE:To obtain a conductive paste which has a high conductivity and an excellent economy, and can improve a short circuit between electrodes and between wirings, when an electric field is applied in the ambiance of a high temperature and a high humidity, by including an almost spherical form of minute particles, a flake form silver powder, a copper powder, and a nitrophenyl hydrazine genus, to the conductive paste. CONSTITUTION:This conductive paste includes an almost spherical form of minute particles with the particle size less than 30mum, a flake form silver powder, a copper powder, and a nitrophenyl hydrazine genus. The ratio of the copper powder, the almost spherical form of minute particles, and the flake form silver powder is favorable to be 1:20 to 1:1 in respect of the conductivity. As the nitrophenyl hydrazine genus, it is favorable to use one sort or a mixture of plural sorts of 3-nitrophenyl hydrazine and 3, 5-dinitrophenyl hydrazines. The amount of the nitrophenyl hydrazine genus is favorable to be 0.05 to 2.0wt% to the solid component of the conductive paste in respect of the migration and the economy.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBw9vdzCXUO8QxzVQhwDA5x5WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgZmxiaWxkYGjsbEqAEADYYdwA</recordid><startdate>19941222</startdate><enddate>19941222</enddate><creator>YAMANA SHOZO</creator><creator>KUWASHIMA HIDEJI</creator><scope>EVB</scope></search><sort><creationdate>19941222</creationdate><title>CONDUCTIVE PASTE</title><author>YAMANA SHOZO ; KUWASHIMA HIDEJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH06349320A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMANA SHOZO</creatorcontrib><creatorcontrib>KUWASHIMA HIDEJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMANA SHOZO</au><au>KUWASHIMA HIDEJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUCTIVE PASTE</title><date>1994-12-22</date><risdate>1994</risdate><abstract>PURPOSE:To obtain a conductive paste which has a high conductivity and an excellent economy, and can improve a short circuit between electrodes and between wirings, when an electric field is applied in the ambiance of a high temperature and a high humidity, by including an almost spherical form of minute particles, a flake form silver powder, a copper powder, and a nitrophenyl hydrazine genus, to the conductive paste. CONSTITUTION:This conductive paste includes an almost spherical form of minute particles with the particle size less than 30mum, a flake form silver powder, a copper powder, and a nitrophenyl hydrazine genus. The ratio of the copper powder, the almost spherical form of minute particles, and the flake form silver powder is favorable to be 1:20 to 1:1 in respect of the conductivity. As the nitrophenyl hydrazine genus, it is favorable to use one sort or a mixture of plural sorts of 3-nitrophenyl hydrazine and 3, 5-dinitrophenyl hydrazines. The amount of the nitrophenyl hydrazine genus is favorable to be 0.05 to 2.0wt% to the solid component of the conductive paste in respect of the migration and the economy.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | CONDUCTIVE PASTE |
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