HIGHLY DENSE PRINTED BOARD AND MANUFACTURE THEREOF

PURPOSE:To prevent solder bridges from being produced on a highly dense printed board provided with surface-mounting pads so as to enhance the printed board in reliability of surface-mounting solder connection. CONSTITUTION:A thermosetting resin film 4 smaller than a conductor in thickness is provid...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAMAOKA NOBUO, FURUKAWA MASAHIRO, MOTOBAYASHI KAZUO, IHARA MATSUTOSHI, MATSUZAKI NAOYA, SATO RYOZO, CHINO TAKAYUKI, TANIGUCHI YUKIHIRO, KADOYA AKIYOSHI, YAMADA KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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