MANUFACTURING METHOD OF BONDING ELECTRODE AND DEVICE HAVING THE SAME

MANUFACTURING METHOD OF BONDING ELECTRODE AND DEVICE HAVING THE SAME

PURPOSE:To provide the device having the aluminum wire bonding resistant to unfavorable environment. CONSTITUTION:A figure (a) represents the first aluminum wire(AW) bonding(BN) step while (c) represents the heating step of the second BN step. In order to bond AW1 onto a thick film conductor 2 forme...

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Hauptverfasser: KAMIMURA RIKIYA, OMI YUJI, NAGAYAMA YOSHITAKA
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KAMIMURA RIKIYA
OMI YUJI
NAGAYAMA YOSHITAKA
description PURPOSE:To provide the device having the aluminum wire bonding resistant to unfavorable environment. CONSTITUTION:A figure (a) represents the first aluminum wire(AW) bonding(BN) step while (c) represents the heating step of the second BN step. In order to bond AW1 onto a thick film conductor 2 formed on a ceramic substrate 4 in the step (a), the AW1 is applied to a connection part using a BN tools 3 to impress the connection part with ultrasonic oscillation (A) for the formation of a junction. As shown in an enlarged figure (b) representing the junction state, there are frits 5 and holes 6 inside the thick film 2 while the AW 1 is junctioned with the metallic compoment of the thick film 2 only on the rugged part in the interface between the AW 1 and the thick film 2. Since this junction is only partial, when the junction part is properly irradiated with laser beams 7 as the second BN step in order to assure this junction, the area of the junction part in the interface can be increased as shown in the figure (d). Furthermore, this invention can provide this device with the strength exceeding the conventional one.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MANUFACTURING METHOD OF BONDING ELECTRODE AND DEVICE HAVING THE SAME
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