MOUNTING STRUCTURE FOR ELECTRONIC CIRCUIT MODULE

PURPOSE:To reduce the number of components, cost, and area of occupation on a mother printed board, and improve the cooling efficiency with respect to the structure of mounting an electronic circuit module on the printed board. CONSTITUTION:This structure of mounting consists of a module case 30 comprising side panels 32 of a U-shape in plan, having a bend 32A inside their lower edge, and a top panel 31 with one side and the bottom open; circuit board 1 the front face of which is mounted with components 2 and the rear face of which is closely secured on the inside face of the top panel 31 of the case; and lead terminals 35 bonded to the side of the circuit board 1, laterally projected from the opening of the module case 30, in parallel with each other. The module case 30 is mounted on a mother printed board 20 by soldering with its bends 32A abutting on the surface of the printed board 20. The lower ends of the lead terminals 35 are soldered to the pattern 21 on the mother printed board 20.