ACTIVE MATRIX SUBSTRATE AND ITS PRODUCTION

PURPOSE:To provide an active matrix substrate with which the high-mobility characteristics required for TFTs for display and the low-off current characteristics required for TFTs for driving are compatibly obtd. CONSTITUTION:The TFTs (a), (b) for driving are formed by continuously laminating a semic...

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Hauptverfasser: TSUCHIMOTO SHUHEI, YOSHINOUCHI ATSUSHI
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YOSHINOUCHI ATSUSHI
description PURPOSE:To provide an active matrix substrate with which the high-mobility characteristics required for TFTs for display and the low-off current characteristics required for TFTs for driving are compatibly obtd. CONSTITUTION:The TFTs (a), (b) for driving are formed by continuously laminating a semiconductor layer 4a and a gate insulating film 5, then patterning the layer and the film to island shapes. The boundaries between the semiconductor layers 4a and the gate insulating films 5 are good and the insulating films 4a are formed to a large film thickness. The TFTs (c) for display are formed by forming the semiconductor layer 4b to a small film thickness and making the resistance of the TFTs higher to decrease off currents and prevent the degradation in the insulation characteristic in the level difference parts of the gate insulating films 3. Further, side wall insulators are formed on the side walls of the gate electrodes 4b and, therefore, these insulators serve as a mask at the time of forming source regions and drain regions. Parts where these impurity ions are implanted or parts 14, 15 where these impurity ions are not implanted are formed among channel parts 20b and the source regions 12b and the drain regions 13b. The off currents at the time of reverse gate bias are thus decreased.
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CONSTITUTION:The TFTs (a), (b) for driving are formed by continuously laminating a semiconductor layer 4a and a gate insulating film 5, then patterning the layer and the film to island shapes. The boundaries between the semiconductor layers 4a and the gate insulating films 5 are good and the insulating films 4a are formed to a large film thickness. The TFTs (c) for display are formed by forming the semiconductor layer 4b to a small film thickness and making the resistance of the TFTs higher to decrease off currents and prevent the degradation in the insulation characteristic in the level difference parts of the gate insulating films 3. Further, side wall insulators are formed on the side walls of the gate electrodes 4b and, therefore, these insulators serve as a mask at the time of forming source regions and drain regions. Parts where these impurity ions are implanted or parts 14, 15 where these impurity ions are not implanted are formed among channel parts 20b and the source regions 12b and the drain regions 13b. 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subjects BASIC ELECTRIC ELEMENTS
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
title ACTIVE MATRIX SUBSTRATE AND ITS PRODUCTION
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