MANUFACTURE OF MULTILAYERED CONDUCTOR FILM CARRIER

MANUFACTURE OF MULTILAYERED CONDUCTOR FILM CARRIER

PURPOSE:To enable fine holes to be bored in a base film independent of its thickness, to form a ground layer isolated from a lead pattern formed on one side by an insulating layer on the opposite side, and to electrically connect a conductor circuit formed on one side to a ground layer formed on the...

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1. Verfasser: SUGIYAMA MAMORU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SUGIYAMA MAMORU
description PURPOSE:To enable fine holes to be bored in a base film independent of its thickness, to form a ground layer isolated from a lead pattern formed on one side by an insulating layer on the opposite side, and to electrically connect a conductor circuit formed on one side to a ground layer formed on the other side. CONSTITUTION:A device hole 14 and slits 15 located around the hole 14 are bored in a base film 10 and a metal foil 13 formed on the rear of the base film 10, and then a conductive foil 17 is bonded to the surface of the base film 10. Then, etching holes 18 are bored in the conductive foil 17 at points corresponding to the slits 15 provided to the base film 10, and resin 19 is poured into the slits 15 to temporarily block the rear side of the etching holes 18. Thereafter, through-holes 20 are bored in the resin 19 corresponding to the etching holes 18, a through-hole plating film 21 is provided to the inner wall of the through-hole 20 coming into contact with the metal foil 13, and the conductive film 17 is formed into a lead pattern 23.
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CONSTITUTION:A device hole 14 and slits 15 located around the hole 14 are bored in a base film 10 and a metal foil 13 formed on the rear of the base film 10, and then a conductive foil 17 is bonded to the surface of the base film 10. Then, etching holes 18 are bored in the conductive foil 17 at points corresponding to the slits 15 provided to the base film 10, and resin 19 is poured into the slits 15 to temporarily block the rear side of the etching holes 18. 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CONSTITUTION:A device hole 14 and slits 15 located around the hole 14 are bored in a base film 10 and a metal foil 13 formed on the rear of the base film 10, and then a conductive foil 17 is bonded to the surface of the base film 10. Then, etching holes 18 are bored in the conductive foil 17 at points corresponding to the slits 15 provided to the base film 10, and resin 19 is poured into the slits 15 to temporarily block the rear side of the etching holes 18. 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CONSTITUTION:A device hole 14 and slits 15 located around the hole 14 are bored in a base film 10 and a metal foil 13 formed on the rear of the base film 10, and then a conductive foil 17 is bonded to the surface of the base film 10. Then, etching holes 18 are bored in the conductive foil 17 at points corresponding to the slits 15 provided to the base film 10, and resin 19 is poured into the slits 15 to temporarily block the rear side of the etching holes 18. Thereafter, through-holes 20 are bored in the resin 19 corresponding to the etching holes 18, a through-hole plating film 21 is provided to the inner wall of the through-hole 20 coming into contact with the metal foil 13, and the conductive film 17 is formed into a lead pattern 23.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MANUFACTURE OF MULTILAYERED CONDUCTOR FILM CARRIER
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