SEMICONDUCTOR DEVICE
PURPOSE:To provide a semiconductor device which can be aligned with high accuracy even when a hollow package made of a molding resin is used. CONSTITUTION:The title device 1 is composed of a base 2 formed by filling the cavity of a mold with a molding resin and curing the resin in the mold, and then...
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| creator | KOYAMA MICHIO |
| description | PURPOSE:To provide a semiconductor device which can be aligned with high accuracy even when a hollow package made of a molding resin is used. CONSTITUTION:The title device 1 is composed of a base 2 formed by filling the cavity of a mold with a molding resin and curing the resin in the mold, and then, releasing the cured resin from the mold by means of an injector pin, semiconductor element 10 which is mounted on a die attaching section 21 provided at nearly the center of the base 2, and an upper lid 3 fitted to a frame section 22 and the abutment section 23 of the base 2 which comes into contact with the injector pin is provided in a recessed section 4 which is deeper than the height of burrs 24. The recessed section 4 is provided in the die attaching section 21 so that the element 10 can be mounted on the section 4, on the lower surface of the base 2, or on a frame section 22. |
| format | Patent |
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CONSTITUTION:The title device 1 is composed of a base 2 formed by filling the cavity of a mold with a molding resin and curing the resin in the mold, and then, releasing the cured resin from the mold by means of an injector pin, semiconductor element 10 which is mounted on a die attaching section 21 provided at nearly the center of the base 2, and an upper lid 3 fitted to a frame section 22 and the abutment section 23 of the base 2 which comes into contact with the injector pin is provided in a recessed section 4 which is deeper than the height of burrs 24. The recessed section 4 is provided in the die attaching section 21 so that the element 10 can be mounted on the section 4, on the lower surface of the base 2, or on a frame section 22.</description><edition>5</edition><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940506&DB=EPODOC&CC=JP&NR=H06125019A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940506&DB=EPODOC&CC=JP&NR=H06125019A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOYAMA MICHIO</creatorcontrib><title>SEMICONDUCTOR DEVICE</title><description>PURPOSE:To provide a semiconductor device which can be aligned with high accuracy even when a hollow package made of a molding resin is used. 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The recessed section 4 is provided in the die attaching section 21 so that the element 10 can be mounted on the section 4, on the lower surface of the base 2, or on a frame section 22.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJdvX1dPb3cwl1DvEPUnBxDfN0duVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GZoZGpgaGlo7GxKgBAIbQHtw</recordid><startdate>19940506</startdate><enddate>19940506</enddate><creator>KOYAMA MICHIO</creator><scope>EVB</scope></search><sort><creationdate>19940506</creationdate><title>SEMICONDUCTOR DEVICE</title><author>KOYAMA MICHIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH06125019A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>KOYAMA MICHIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOYAMA MICHIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMICONDUCTOR DEVICE</title><date>1994-05-06</date><risdate>1994</risdate><abstract>PURPOSE:To provide a semiconductor device which can be aligned with high accuracy even when a hollow package made of a molding resin is used. CONSTITUTION:The title device 1 is composed of a base 2 formed by filling the cavity of a mold with a molding resin and curing the resin in the mold, and then, releasing the cured resin from the mold by means of an injector pin, semiconductor element 10 which is mounted on a die attaching section 21 provided at nearly the center of the base 2, and an upper lid 3 fitted to a frame section 22 and the abutment section 23 of the base 2 which comes into contact with the injector pin is provided in a recessed section 4 which is deeper than the height of burrs 24. The recessed section 4 is provided in the die attaching section 21 so that the element 10 can be mounted on the section 4, on the lower surface of the base 2, or on a frame section 22.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | SEMICONDUCTOR DEVICE |
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