SURFACE TREATING DEVICE
PURPOSE:To evenly and uniformly etch the front and rear faces of a material to be treated by washing the material, then treating the material surface in an etching part provided with a disk which is eccentrically rotated, then performing washing and drying the material. CONSTITUTION:The front and re...
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| creator | OKI NOBUAKI TAKANASHI YASUO NOHARA SHOZO HIROYA YOSHINOBU YOSHITOMI SATOSHI |
| description | PURPOSE:To evenly and uniformly etch the front and rear faces of a material to be treated by washing the material, then treating the material surface in an etching part provided with a disk which is eccentrically rotated, then performing washing and drying the material. CONSTITUTION:The front and rear faces of a material 90 such as a steel sheet or plate with a resist pattern formed thereon are washed in a first washing part 10, then, the material is introduced into an etching chamber 20 vertically to the horizontal and fixed to a disk 31 placed on an origin roller 33, and the disk 31 is put on an eccentric roller 32 by operating cylinders 34 and 35. Then disk 31 is eccentrically rotated by the eccentric roller 32, an etchant is injected uniformly on both sides of the material 90 on the disk 31, air is then injected by an air knife mechanism 40 to remove the etchant, and etching is stopped. The material 90 is washed in a second washing part 50 and dried in a drying part 60, and the material is evenly and uniformly etched by the etchant. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH06122981A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH06122981A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH06122981A3</originalsourceid><addsrcrecordid>eNrjZBAPDg1yc3R2VQgJcnUM8fRzV3BxDfN0duVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GZoZGRpYWho7GxKgBANO9H5E</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SURFACE TREATING DEVICE</title><source>esp@cenet</source><creator>OKI NOBUAKI ; TAKANASHI YASUO ; NOHARA SHOZO ; HIROYA YOSHINOBU ; YOSHITOMI SATOSHI</creator><creatorcontrib>OKI NOBUAKI ; TAKANASHI YASUO ; NOHARA SHOZO ; HIROYA YOSHINOBU ; YOSHITOMI SATOSHI</creatorcontrib><description>PURPOSE:To evenly and uniformly etch the front and rear faces of a material to be treated by washing the material, then treating the material surface in an etching part provided with a disk which is eccentrically rotated, then performing washing and drying the material. CONSTITUTION:The front and rear faces of a material 90 such as a steel sheet or plate with a resist pattern formed thereon are washed in a first washing part 10, then, the material is introduced into an etching chamber 20 vertically to the horizontal and fixed to a disk 31 placed on an origin roller 33, and the disk 31 is put on an eccentric roller 32 by operating cylinders 34 and 35. Then disk 31 is eccentrically rotated by the eccentric roller 32, an etchant is injected uniformly on both sides of the material 90 on the disk 31, air is then injected by an air knife mechanism 40 to remove the etchant, and etching is stopped. The material 90 is washed in a second washing part 50 and dried in a drying part 60, and the material is evenly and uniformly etched by the etchant.</description><edition>5</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CINEMATOGRAPHY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940506&DB=EPODOC&CC=JP&NR=H06122981A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940506&DB=EPODOC&CC=JP&NR=H06122981A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKI NOBUAKI</creatorcontrib><creatorcontrib>TAKANASHI YASUO</creatorcontrib><creatorcontrib>NOHARA SHOZO</creatorcontrib><creatorcontrib>HIROYA YOSHINOBU</creatorcontrib><creatorcontrib>YOSHITOMI SATOSHI</creatorcontrib><title>SURFACE TREATING DEVICE</title><description>PURPOSE:To evenly and uniformly etch the front and rear faces of a material to be treated by washing the material, then treating the material surface in an etching part provided with a disk which is eccentrically rotated, then performing washing and drying the material. CONSTITUTION:The front and rear faces of a material 90 such as a steel sheet or plate with a resist pattern formed thereon are washed in a first washing part 10, then, the material is introduced into an etching chamber 20 vertically to the horizontal and fixed to a disk 31 placed on an origin roller 33, and the disk 31 is put on an eccentric roller 32 by operating cylinders 34 and 35. Then disk 31 is eccentrically rotated by the eccentric roller 32, an etchant is injected uniformly on both sides of the material 90 on the disk 31, air is then injected by an air knife mechanism 40 to remove the etchant, and etching is stopped. The material 90 is washed in a second washing part 50 and dried in a drying part 60, and the material is evenly and uniformly etched by the etchant.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAPDg1yc3R2VQgJcnUM8fRzV3BxDfN0duVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GZoZGRpYWho7GxKgBANO9H5E</recordid><startdate>19940506</startdate><enddate>19940506</enddate><creator>OKI NOBUAKI</creator><creator>TAKANASHI YASUO</creator><creator>NOHARA SHOZO</creator><creator>HIROYA YOSHINOBU</creator><creator>YOSHITOMI SATOSHI</creator><scope>EVB</scope></search><sort><creationdate>19940506</creationdate><title>SURFACE TREATING DEVICE</title><author>OKI NOBUAKI ; TAKANASHI YASUO ; NOHARA SHOZO ; HIROYA YOSHINOBU ; YOSHITOMI SATOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH06122981A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OKI NOBUAKI</creatorcontrib><creatorcontrib>TAKANASHI YASUO</creatorcontrib><creatorcontrib>NOHARA SHOZO</creatorcontrib><creatorcontrib>HIROYA YOSHINOBU</creatorcontrib><creatorcontrib>YOSHITOMI SATOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKI NOBUAKI</au><au>TAKANASHI YASUO</au><au>NOHARA SHOZO</au><au>HIROYA YOSHINOBU</au><au>YOSHITOMI SATOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE TREATING DEVICE</title><date>1994-05-06</date><risdate>1994</risdate><abstract>PURPOSE:To evenly and uniformly etch the front and rear faces of a material to be treated by washing the material, then treating the material surface in an etching part provided with a disk which is eccentrically rotated, then performing washing and drying the material. CONSTITUTION:The front and rear faces of a material 90 such as a steel sheet or plate with a resist pattern formed thereon are washed in a first washing part 10, then, the material is introduced into an etching chamber 20 vertically to the horizontal and fixed to a disk 31 placed on an origin roller 33, and the disk 31 is put on an eccentric roller 32 by operating cylinders 34 and 35. Then disk 31 is eccentrically rotated by the eccentric roller 32, an etchant is injected uniformly on both sides of the material 90 on the disk 31, air is then injected by an air knife mechanism 40 to remove the etchant, and etching is stopped. The material 90 is washed in a second washing part 50 and dried in a drying part 60, and the material is evenly and uniformly etched by the etchant.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | SURFACE TREATING DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T13%3A33%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OKI%20NOBUAKI&rft.date=1994-05-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH06122981A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |