IC SOCKET
PURPOSE:To reduce the number of types of IC sockets by dividing an IC socket into two half-socket bodies, wherein the interval of the half-socket bodies on a printed board can be adjusted, and link members of contacts can be cut in accordance with the number of terminals of an IC to be used. CONSTIT...
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| creator | FUJISAKI TSUTOMU |
| description | PURPOSE:To reduce the number of types of IC sockets by dividing an IC socket into two half-socket bodies, wherein the interval of the half-socket bodies on a printed board can be adjusted, and link members of contacts can be cut in accordance with the number of terminals of an IC to be used. CONSTITUTION:A plurality of contacts 2 which come in contact with terminals 6a of an IC are arranged at the interval which is matched with the pitch of an IC 6. Two half-socket bodies 1 are prepared by integrally connecting the contacts 2, at appropriate locations thereof, to one another by means of insulative link members 3 and 4, and these half-socket bodies 1 are mounted on a printed board 7. When an IC 6 is interposed between the half-socket bodies 1, positioning leaves 5are inserted between the terminals 6a of the IC under the resilience of the bent contacts 2, so that the IC 6 is resiliently held from both sides thereof. For this purpose, the link members 3 and 4 are arranged so that they can be cut according to the number of terminals of the IC 6 to be used. Thereby, the number of types of IC sockets can be reduced to the least. |
| format | Patent |
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CONSTITUTION:A plurality of contacts 2 which come in contact with terminals 6a of an IC are arranged at the interval which is matched with the pitch of an IC 6. Two half-socket bodies 1 are prepared by integrally connecting the contacts 2, at appropriate locations thereof, to one another by means of insulative link members 3 and 4, and these half-socket bodies 1 are mounted on a printed board 7. When an IC 6 is interposed between the half-socket bodies 1, positioning leaves 5are inserted between the terminals 6a of the IC under the resilience of the bent contacts 2, so that the IC 6 is resiliently held from both sides thereof. For this purpose, the link members 3 and 4 are arranged so that they can be cut according to the number of terminals of the IC 6 to be used. Thereby, the number of types of IC sockets can be reduced to the least.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930402&DB=EPODOC&CC=JP&NR=H0582681A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930402&DB=EPODOC&CC=JP&NR=H0582681A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJISAKI TSUTOMU</creatorcontrib><title>IC SOCKET</title><description>PURPOSE:To reduce the number of types of IC sockets by dividing an IC socket into two half-socket bodies, wherein the interval of the half-socket bodies on a printed board can be adjusted, and link members of contacts can be cut in accordance with the number of terminals of an IC to be used. CONSTITUTION:A plurality of contacts 2 which come in contact with terminals 6a of an IC are arranged at the interval which is matched with the pitch of an IC 6. Two half-socket bodies 1 are prepared by integrally connecting the contacts 2, at appropriate locations thereof, to one another by means of insulative link members 3 and 4, and these half-socket bodies 1 are mounted on a printed board 7. When an IC 6 is interposed between the half-socket bodies 1, positioning leaves 5are inserted between the terminals 6a of the IC under the resilience of the bent contacts 2, so that the IC 6 is resiliently held from both sides thereof. For this purpose, the link members 3 and 4 are arranged so that they can be cut according to the number of terminals of the IC 6 to be used. Thereby, the number of types of IC sockets can be reduced to the least.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD0dFYI9nf2dg3hYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgEeBqYWRmYWho7GRCgBAAIqG0E</recordid><startdate>19930402</startdate><enddate>19930402</enddate><creator>FUJISAKI TSUTOMU</creator><scope>EVB</scope></search><sort><creationdate>19930402</creationdate><title>IC SOCKET</title><author>FUJISAKI TSUTOMU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0582681A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJISAKI TSUTOMU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJISAKI TSUTOMU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IC SOCKET</title><date>1993-04-02</date><risdate>1993</risdate><abstract>PURPOSE:To reduce the number of types of IC sockets by dividing an IC socket into two half-socket bodies, wherein the interval of the half-socket bodies on a printed board can be adjusted, and link members of contacts can be cut in accordance with the number of terminals of an IC to be used. CONSTITUTION:A plurality of contacts 2 which come in contact with terminals 6a of an IC are arranged at the interval which is matched with the pitch of an IC 6. Two half-socket bodies 1 are prepared by integrally connecting the contacts 2, at appropriate locations thereof, to one another by means of insulative link members 3 and 4, and these half-socket bodies 1 are mounted on a printed board 7. When an IC 6 is interposed between the half-socket bodies 1, positioning leaves 5are inserted between the terminals 6a of the IC under the resilience of the bent contacts 2, so that the IC 6 is resiliently held from both sides thereof. For this purpose, the link members 3 and 4 are arranged so that they can be cut according to the number of terminals of the IC 6 to be used. Thereby, the number of types of IC sockets can be reduced to the least.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | IC SOCKET |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T12%3A43%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FUJISAKI%20TSUTOMU&rft.date=1993-04-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH0582681A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |