HEAT DISSIPATING DEVICE

PURPOSE:To obtain a heat dissipating device having excellent heat dissipating characteristics by dispersing the air heated in a hole from the upper surface of a block through holes of a second group, sucking the cold air of the atmosphere into holes of a first group in that case, and further conveyi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: ITOU SATOMI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ITOU SATOMI
description PURPOSE:To obtain a heat dissipating device having excellent heat dissipating characteristics by dispersing the air heated in a hole from the upper surface of a block through holes of a second group, sucking the cold air of the atmosphere into holes of a first group in that case, and further conveying heat generated from inner wall surfaces for defining the holes to dissipate it from the upper surface of the block into the atmosphere. CONSTITUTION:A heat dissipating device 10 has a rectangular parallelepiped block 11. The block 11 has holes 12-19 of a first group for inducing a convention of the air and holes 20-23 of a second group. Passages for circulating vapor and liquid to be operated as functions of heat pipes are so formed in the block 11 as to extend in directions X, Y and Z. The opening ends of the passages are blocked by pins 51. Operating fluids sealed in the passages are frequently repeated to be evaporated and condensed. The liquid condensed in a heat dissipating unit is returned to a heater through inner wall surfaces for defining the passages.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0567890A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0567890A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0567890A3</originalsourceid><addsrcrecordid>eNrjZBD3cHUMUXDxDA72DHAM8fRzV3BxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GpmbmFpYGjsZEKAEAlfEfNQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT DISSIPATING DEVICE</title><source>esp@cenet</source><creator>ITOU SATOMI</creator><creatorcontrib>ITOU SATOMI</creatorcontrib><description>PURPOSE:To obtain a heat dissipating device having excellent heat dissipating characteristics by dispersing the air heated in a hole from the upper surface of a block through holes of a second group, sucking the cold air of the atmosphere into holes of a first group in that case, and further conveying heat generated from inner wall surfaces for defining the holes to dissipate it from the upper surface of the block into the atmosphere. CONSTITUTION:A heat dissipating device 10 has a rectangular parallelepiped block 11. The block 11 has holes 12-19 of a first group for inducing a convention of the air and holes 20-23 of a second group. Passages for circulating vapor and liquid to be operated as functions of heat pipes are so formed in the block 11 as to extend in directions X, Y and Z. The opening ends of the passages are blocked by pins 51. Operating fluids sealed in the passages are frequently repeated to be evaporated and condensed. The liquid condensed in a heat dissipating unit is returned to a heater through inner wall surfaces for defining the passages.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930319&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0567890A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930319&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0567890A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ITOU SATOMI</creatorcontrib><title>HEAT DISSIPATING DEVICE</title><description>PURPOSE:To obtain a heat dissipating device having excellent heat dissipating characteristics by dispersing the air heated in a hole from the upper surface of a block through holes of a second group, sucking the cold air of the atmosphere into holes of a first group in that case, and further conveying heat generated from inner wall surfaces for defining the holes to dissipate it from the upper surface of the block into the atmosphere. CONSTITUTION:A heat dissipating device 10 has a rectangular parallelepiped block 11. The block 11 has holes 12-19 of a first group for inducing a convention of the air and holes 20-23 of a second group. Passages for circulating vapor and liquid to be operated as functions of heat pipes are so formed in the block 11 as to extend in directions X, Y and Z. The opening ends of the passages are blocked by pins 51. Operating fluids sealed in the passages are frequently repeated to be evaporated and condensed. The liquid condensed in a heat dissipating unit is returned to a heater through inner wall surfaces for defining the passages.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD3cHUMUXDxDA72DHAM8fRzV3BxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GpmbmFpYGjsZEKAEAlfEfNQ</recordid><startdate>19930319</startdate><enddate>19930319</enddate><creator>ITOU SATOMI</creator><scope>EVB</scope></search><sort><creationdate>19930319</creationdate><title>HEAT DISSIPATING DEVICE</title><author>ITOU SATOMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0567890A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>ITOU SATOMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ITOU SATOMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT DISSIPATING DEVICE</title><date>1993-03-19</date><risdate>1993</risdate><abstract>PURPOSE:To obtain a heat dissipating device having excellent heat dissipating characteristics by dispersing the air heated in a hole from the upper surface of a block through holes of a second group, sucking the cold air of the atmosphere into holes of a first group in that case, and further conveying heat generated from inner wall surfaces for defining the holes to dissipate it from the upper surface of the block into the atmosphere. CONSTITUTION:A heat dissipating device 10 has a rectangular parallelepiped block 11. The block 11 has holes 12-19 of a first group for inducing a convention of the air and holes 20-23 of a second group. Passages for circulating vapor and liquid to be operated as functions of heat pipes are so formed in the block 11 as to extend in directions X, Y and Z. The opening ends of the passages are blocked by pins 51. Operating fluids sealed in the passages are frequently repeated to be evaporated and condensed. The liquid condensed in a heat dissipating unit is returned to a heater through inner wall surfaces for defining the passages.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPH0567890A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
WEAPONS
title HEAT DISSIPATING DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T11%3A46%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ITOU%20SATOMI&rft.date=1993-03-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH0567890A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true