POLYAMIDE COMPOSITION
PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein...
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creator | KITAMURA KAZUYUKI MORITA KIMIHIRO |
description | PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M (HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product. |
format | Patent |
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CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M (HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930302&DB=EPODOC&CC=JP&NR=H0551531A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930302&DB=EPODOC&CC=JP&NR=H0551531A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KITAMURA KAZUYUKI</creatorcontrib><creatorcontrib>MORITA KIMIHIRO</creatorcontrib><title>POLYAMIDE COMPOSITION</title><description>PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M (HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAN8PeJdPT1dHFVcPb3DfAP9gzx9PfjYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgEeBqamhqbGho7GRCgBAHXmHtw</recordid><startdate>19930302</startdate><enddate>19930302</enddate><creator>KITAMURA KAZUYUKI</creator><creator>MORITA KIMIHIRO</creator><scope>EVB</scope></search><sort><creationdate>19930302</creationdate><title>POLYAMIDE COMPOSITION</title><author>KITAMURA KAZUYUKI ; MORITA KIMIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0551531A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KITAMURA KAZUYUKI</creatorcontrib><creatorcontrib>MORITA KIMIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KITAMURA KAZUYUKI</au><au>MORITA KIMIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYAMIDE COMPOSITION</title><date>1993-03-02</date><risdate>1993</risdate><abstract>PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M (HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | POLYAMIDE COMPOSITION |
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