POLYAMIDE COMPOSITION

PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KITAMURA KAZUYUKI, MORITA KIMIHIRO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KITAMURA KAZUYUKI
MORITA KIMIHIRO
description PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M (HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0551531A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0551531A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0551531A3</originalsourceid><addsrcrecordid>eNrjZBAN8PeJdPT1dHFVcPb3DfAP9gzx9PfjYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgEeBqamhqbGho7GRCgBAHXmHtw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLYAMIDE COMPOSITION</title><source>esp@cenet</source><creator>KITAMURA KAZUYUKI ; MORITA KIMIHIRO</creator><creatorcontrib>KITAMURA KAZUYUKI ; MORITA KIMIHIRO</creatorcontrib><description>PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M (HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930302&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0551531A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19930302&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0551531A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KITAMURA KAZUYUKI</creatorcontrib><creatorcontrib>MORITA KIMIHIRO</creatorcontrib><title>POLYAMIDE COMPOSITION</title><description>PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M (HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAN8PeJdPT1dHFVcPb3DfAP9gzx9PfjYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxXgEeBqamhqbGho7GRCgBAHXmHtw</recordid><startdate>19930302</startdate><enddate>19930302</enddate><creator>KITAMURA KAZUYUKI</creator><creator>MORITA KIMIHIRO</creator><scope>EVB</scope></search><sort><creationdate>19930302</creationdate><title>POLYAMIDE COMPOSITION</title><author>KITAMURA KAZUYUKI ; MORITA KIMIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0551531A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KITAMURA KAZUYUKI</creatorcontrib><creatorcontrib>MORITA KIMIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KITAMURA KAZUYUKI</au><au>MORITA KIMIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYAMIDE COMPOSITION</title><date>1993-03-02</date><risdate>1993</risdate><abstract>PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing the gelation of polymethyleneadipamide during polymeriza tion and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide (a) and a compound (b) of general formula MHSO3 (wherein M is an alkali metal) or general formula M (HSO3)2 (wherein M is an alkaline earth metal). The additive (b) for preventing gelation exhibits a remarkable effect of preventing the gelation of the polymethyleneadipamide (a) and causes very little foaming of the polymer. The additive, when added before or during polymerization, can prevent the gelation during polymerization and has no adverse effect such as the inhibition of polymerization, so that finer polyamide can be obtained. When added before molding, it causes neither the foaming of an obtained molding due to gelation nor the breakage of fiber, so that it does not reduce the yield of a polyamide product.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPH0551531A
source esp@cenet
subjects CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title POLYAMIDE COMPOSITION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T04%3A58%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KITAMURA%20KAZUYUKI&rft.date=1993-03-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH0551531A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true