JPH05335700

PURPOSE:To manufacture a composite wiring board having excellent heat radiating property, strength, and workability by opening parts required for radiating heat in a resin-base wiring board and filling the opened parts with an inorganic material, and then, integrating the inorganic material. CONSTIT...

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Bibliographische Detailangaben
1. Verfasser: MURAKAMI HISAO
Format: Patent
Sprache:eng
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