MANUFACTURE OF DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT
PURPOSE:To provide a device for mounting a semiconductor element having stepped parts by a general plating method without needing a high positioning accuracy. CONSTITUTION:In a method of manufacturing a device for semiconductor element mounting use of a structure, wherein while a recessed part 10 wi...
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| creator | NAKAMURA MASANORI MOMOSE TERUHISA TAMURA TADASHI YABUKI TAKAYOSHI |
| description | PURPOSE:To provide a device for mounting a semiconductor element having stepped parts by a general plating method without needing a high positioning accuracy. CONSTITUTION:In a method of manufacturing a device for semiconductor element mounting use of a structure, wherein while a recessed part 10 with the flat bottom is formed at a prescribed position, a plurality of sheets of organic substrates, each formed with a wiring, are laminated to form a multilayer wiring board having stepped parts, through holes 9 are formed at arbitrary places other than the place of the recessed part 10 and a plating is applied to the holes 9, the organic substrates (polyimide resin glass-cloth base material copper-clad laminates) 4 and 4' are laminated and thereafter, the outermost side of the multilayer wiring board is covered with chemical-resistant resin films 1 and 1', then, the through holes 9 are formed and after a plated film 8 is formed on the sidewalls of the holes 9, the films 1 and 1' are peeled from the outermost side. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH05326747A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH05326747A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH05326747A3</originalsourceid><addsrcrecordid>eNrjZLDwdfQLdXN0DgkNclXwd1NwcQ3zdHZVcPMPUvD1D_UL8fRzVwh29fV09vdzCXUOAQq7-rj6uvqF8DCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeK8ADwNTYyMzcxNzR2Ni1AAAeyAo5g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MANUFACTURE OF DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT</title><source>esp@cenet</source><creator>NAKAMURA MASANORI ; MOMOSE TERUHISA ; TAMURA TADASHI ; YABUKI TAKAYOSHI</creator><creatorcontrib>NAKAMURA MASANORI ; MOMOSE TERUHISA ; TAMURA TADASHI ; YABUKI TAKAYOSHI</creatorcontrib><description>PURPOSE:To provide a device for mounting a semiconductor element having stepped parts by a general plating method without needing a high positioning accuracy. CONSTITUTION:In a method of manufacturing a device for semiconductor element mounting use of a structure, wherein while a recessed part 10 with the flat bottom is formed at a prescribed position, a plurality of sheets of organic substrates, each formed with a wiring, are laminated to form a multilayer wiring board having stepped parts, through holes 9 are formed at arbitrary places other than the place of the recessed part 10 and a plating is applied to the holes 9, the organic substrates (polyimide resin glass-cloth base material copper-clad laminates) 4 and 4' are laminated and thereafter, the outermost side of the multilayer wiring board is covered with chemical-resistant resin films 1 and 1', then, the through holes 9 are formed and after a plated film 8 is formed on the sidewalls of the holes 9, the films 1 and 1' are peeled from the outermost side.</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931210&DB=EPODOC&CC=JP&NR=H05326747A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931210&DB=EPODOC&CC=JP&NR=H05326747A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAMURA MASANORI</creatorcontrib><creatorcontrib>MOMOSE TERUHISA</creatorcontrib><creatorcontrib>TAMURA TADASHI</creatorcontrib><creatorcontrib>YABUKI TAKAYOSHI</creatorcontrib><title>MANUFACTURE OF DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT</title><description>PURPOSE:To provide a device for mounting a semiconductor element having stepped parts by a general plating method without needing a high positioning accuracy. CONSTITUTION:In a method of manufacturing a device for semiconductor element mounting use of a structure, wherein while a recessed part 10 with the flat bottom is formed at a prescribed position, a plurality of sheets of organic substrates, each formed with a wiring, are laminated to form a multilayer wiring board having stepped parts, through holes 9 are formed at arbitrary places other than the place of the recessed part 10 and a plating is applied to the holes 9, the organic substrates (polyimide resin glass-cloth base material copper-clad laminates) 4 and 4' are laminated and thereafter, the outermost side of the multilayer wiring board is covered with chemical-resistant resin films 1 and 1', then, the through holes 9 are formed and after a plated film 8 is formed on the sidewalls of the holes 9, the films 1 and 1' are peeled from the outermost side.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDwdfQLdXN0DgkNclXwd1NwcQ3zdHZVcPMPUvD1D_UL8fRzVwh29fV09vdzCXUOAQq7-rj6uvqF8DCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeK8ADwNTYyMzcxNzR2Ni1AAAeyAo5g</recordid><startdate>19931210</startdate><enddate>19931210</enddate><creator>NAKAMURA MASANORI</creator><creator>MOMOSE TERUHISA</creator><creator>TAMURA TADASHI</creator><creator>YABUKI TAKAYOSHI</creator><scope>EVB</scope></search><sort><creationdate>19931210</creationdate><title>MANUFACTURE OF DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT</title><author>NAKAMURA MASANORI ; MOMOSE TERUHISA ; TAMURA TADASHI ; YABUKI TAKAYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH05326747A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAMURA MASANORI</creatorcontrib><creatorcontrib>MOMOSE TERUHISA</creatorcontrib><creatorcontrib>TAMURA TADASHI</creatorcontrib><creatorcontrib>YABUKI TAKAYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAMURA MASANORI</au><au>MOMOSE TERUHISA</au><au>TAMURA TADASHI</au><au>YABUKI TAKAYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT</title><date>1993-12-10</date><risdate>1993</risdate><abstract>PURPOSE:To provide a device for mounting a semiconductor element having stepped parts by a general plating method without needing a high positioning accuracy. CONSTITUTION:In a method of manufacturing a device for semiconductor element mounting use of a structure, wherein while a recessed part 10 with the flat bottom is formed at a prescribed position, a plurality of sheets of organic substrates, each formed with a wiring, are laminated to form a multilayer wiring board having stepped parts, through holes 9 are formed at arbitrary places other than the place of the recessed part 10 and a plating is applied to the holes 9, the organic substrates (polyimide resin glass-cloth base material copper-clad laminates) 4 and 4' are laminated and thereafter, the outermost side of the multilayer wiring board is covered with chemical-resistant resin films 1 and 1', then, the through holes 9 are formed and after a plated film 8 is formed on the sidewalls of the holes 9, the films 1 and 1' are peeled from the outermost side.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | MANUFACTURE OF DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT |
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