MANUFACTURE OF SEMICONDUCTOR DEVICE
PURPOSE:To enable a pattern to be sharply lessened in dimensional error so as to obtain a polycrystalline silicon gate element of high accuracy by a method wherein a thin silicon oxide film formed at a low temperature is used as an etching mask. CONSTITUTION:In a method of manufacturing a semiconduc...
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creator | IMAI KAZUO KIMIZUKA MASAKATSU SEKIMOTO MISAO |
description | PURPOSE:To enable a pattern to be sharply lessened in dimensional error so as to obtain a polycrystalline silicon gate element of high accuracy by a method wherein a thin silicon oxide film formed at a low temperature is used as an etching mask. CONSTITUTION:In a method of manufacturing a semiconductor device, where an amorphous silicon film 53 is deposited on a substrate 51 and then selectively etched using a mask pattern formed on the film 52, and the substrate 51 is thermally treated to turn the amorphous silicon film 53 polycrystalline, a thin silicon oxide film 54 which is formed at a low temperature at which an amorphous silicon film is not turned polycrystalline is used as the mask pattern formed on the amorphous silicon film 53. |
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CONSTITUTION:In a method of manufacturing a semiconductor device, where an amorphous silicon film 53 is deposited on a substrate 51 and then selectively etched using a mask pattern formed on the film 52, and the substrate 51 is thermally treated to turn the amorphous silicon film 53 polycrystalline, a thin silicon oxide film 54 which is formed at a low temperature at which an amorphous silicon film is not turned polycrystalline is used as the mask pattern formed on the amorphous silicon film 53.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930108&DB=EPODOC&CC=JP&NR=H053182A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930108&DB=EPODOC&CC=JP&NR=H053182A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IMAI KAZUO</creatorcontrib><creatorcontrib>KIMIZUKA MASAKATSU</creatorcontrib><creatorcontrib>SEKIMOTO MISAO</creatorcontrib><title>MANUFACTURE OF SEMICONDUCTOR DEVICE</title><description>PURPOSE:To enable a pattern to be sharply lessened in dimensional error so as to obtain a polycrystalline silicon gate element of high accuracy by a method wherein a thin silicon oxide film formed at a low temperature is used as an etching mask. 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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | MANUFACTURE OF SEMICONDUCTOR DEVICE |
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