JPH05298919
PURPOSE:To provide sufficient mechanical strength to a composite substrate, make its thermal expansion coefficient near that of silicon and its dielectric constant low, and fire at low temperature by making the composite circuit substrate using a cordierite-anorthite-boron-based composite and provid...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ARAI HIROSHI NAKAI ZENJIRO EMU JII EMU YUU ISUMAIRU |
| description | PURPOSE:To provide sufficient mechanical strength to a composite substrate, make its thermal expansion coefficient near that of silicon and its dielectric constant low, and fire at low temperature by making the composite circuit substrate using a cordierite-anorthite-boron-based composite and providing a fine structure to the composite circuit substrate wherein the anorthite is taken in the cordierite phase. CONSTITUTION:A composite circuit substrate is made of a cordierite-anorthite- boron-based composite material and has a fine structure wherein the anorthite is taken in the cordierite phase. The weight ratio of cordierite/anorthite is (50-95)/(5-50) and boron (calculated in terms of B2O3) to cordierite is 0.5-10wt.%. A cordierite-anorthite composite composition sol is prepared by mixing boehmite sol, silica sol, a water-soluble magnesium salt, and a water-soluble calcium salt, gelled, calcined, and sintered. As a result, the resulting composite circuit substrate has sufficient mechanical strength, thermal expansion coefficient near that of silicon, low dielectric constant, and can be sintered at low temperature. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH05298919A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH05298919A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH05298919A3</originalsourceid><addsrcrecordid>eNrjZOD2CvAwMDWytLA0tORhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFIOhyNiVEDAEWPG9c</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>JPH05298919</title><source>esp@cenet</source><creator>ARAI HIROSHI ; NAKAI ZENJIRO ; EMU JII EMU YUU ISUMAIRU</creator><creatorcontrib>ARAI HIROSHI ; NAKAI ZENJIRO ; EMU JII EMU YUU ISUMAIRU</creatorcontrib><description>PURPOSE:To provide sufficient mechanical strength to a composite substrate, make its thermal expansion coefficient near that of silicon and its dielectric constant low, and fire at low temperature by making the composite circuit substrate using a cordierite-anorthite-boron-based composite and providing a fine structure to the composite circuit substrate wherein the anorthite is taken in the cordierite phase. CONSTITUTION:A composite circuit substrate is made of a cordierite-anorthite- boron-based composite material and has a fine structure wherein the anorthite is taken in the cordierite phase. The weight ratio of cordierite/anorthite is (50-95)/(5-50) and boron (calculated in terms of B2O3) to cordierite is 0.5-10wt.%. A cordierite-anorthite composite composition sol is prepared by mixing boehmite sol, silica sol, a water-soluble magnesium salt, and a water-soluble calcium salt, gelled, calcined, and sintered. As a result, the resulting composite circuit substrate has sufficient mechanical strength, thermal expansion coefficient near that of silicon, low dielectric constant, and can be sintered at low temperature.</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931112&DB=EPODOC&CC=JP&NR=H05298919A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931112&DB=EPODOC&CC=JP&NR=H05298919A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARAI HIROSHI</creatorcontrib><creatorcontrib>NAKAI ZENJIRO</creatorcontrib><creatorcontrib>EMU JII EMU YUU ISUMAIRU</creatorcontrib><title>JPH05298919</title><description>PURPOSE:To provide sufficient mechanical strength to a composite substrate, make its thermal expansion coefficient near that of silicon and its dielectric constant low, and fire at low temperature by making the composite circuit substrate using a cordierite-anorthite-boron-based composite and providing a fine structure to the composite circuit substrate wherein the anorthite is taken in the cordierite phase. CONSTITUTION:A composite circuit substrate is made of a cordierite-anorthite- boron-based composite material and has a fine structure wherein the anorthite is taken in the cordierite phase. The weight ratio of cordierite/anorthite is (50-95)/(5-50) and boron (calculated in terms of B2O3) to cordierite is 0.5-10wt.%. A cordierite-anorthite composite composition sol is prepared by mixing boehmite sol, silica sol, a water-soluble magnesium salt, and a water-soluble calcium salt, gelled, calcined, and sintered. As a result, the resulting composite circuit substrate has sufficient mechanical strength, thermal expansion coefficient near that of silicon, low dielectric constant, and can be sintered at low temperature.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD2CvAwMDWytLA0tORhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFIOhyNiVEDAEWPG9c</recordid><startdate>19931112</startdate><enddate>19931112</enddate><creator>ARAI HIROSHI</creator><creator>NAKAI ZENJIRO</creator><creator>EMU JII EMU YUU ISUMAIRU</creator><scope>EVB</scope></search><sort><creationdate>19931112</creationdate><title>JPH05298919</title><author>ARAI HIROSHI ; NAKAI ZENJIRO ; EMU JII EMU YUU ISUMAIRU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH05298919A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>ARAI HIROSHI</creatorcontrib><creatorcontrib>NAKAI ZENJIRO</creatorcontrib><creatorcontrib>EMU JII EMU YUU ISUMAIRU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARAI HIROSHI</au><au>NAKAI ZENJIRO</au><au>EMU JII EMU YUU ISUMAIRU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JPH05298919</title><date>1993-11-12</date><risdate>1993</risdate><abstract>PURPOSE:To provide sufficient mechanical strength to a composite substrate, make its thermal expansion coefficient near that of silicon and its dielectric constant low, and fire at low temperature by making the composite circuit substrate using a cordierite-anorthite-boron-based composite and providing a fine structure to the composite circuit substrate wherein the anorthite is taken in the cordierite phase. CONSTITUTION:A composite circuit substrate is made of a cordierite-anorthite- boron-based composite material and has a fine structure wherein the anorthite is taken in the cordierite phase. The weight ratio of cordierite/anorthite is (50-95)/(5-50) and boron (calculated in terms of B2O3) to cordierite is 0.5-10wt.%. A cordierite-anorthite composite composition sol is prepared by mixing boehmite sol, silica sol, a water-soluble magnesium salt, and a water-soluble calcium salt, gelled, calcined, and sintered. As a result, the resulting composite circuit substrate has sufficient mechanical strength, thermal expansion coefficient near that of silicon, low dielectric constant, and can be sintered at low temperature.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH05298919A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
| title | JPH05298919 |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T16%3A48%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ARAI%20HIROSHI&rft.date=1993-11-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH05298919A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |