JPH05251507

PURPOSE:To form a fine solder dam and provide the reliability of a wiring part by providing a hole corresponding to the connecting pad of an electronic component and separately providing the films for the solder dam and for the wiring protection. CONSTITUTION:Metal wiring 2 is provided on a substrat...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	RAI AKITERU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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