JPH05251507
PURPOSE:To form a fine solder dam and provide the reliability of a wiring part by providing a hole corresponding to the connecting pad of an electronic component and separately providing the films for the solder dam and for the wiring protection. CONSTITUTION:Metal wiring 2 is provided on a substrat...
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| creator | RAI AKITERU |
| description | PURPOSE:To form a fine solder dam and provide the reliability of a wiring part by providing a hole corresponding to the connecting pad of an electronic component and separately providing the films for the solder dam and for the wiring protection. CONSTITUTION:Metal wiring 2 is provided on a substrate 1, fine processing is performed by thinly forming photosensitive solder resist 3 on the connecting part of an electronic component and a hole 10 is formed to be a solder dam. Rather thin solder resist 4 is formed in an area other than the area close to the hole 10 and the wiring is protected. Since the films are separately used for the solder dam and for the wire protection, a highly reliable flip chip wiring substrate is formed while having the fine connecting pad. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH05251507A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH05251507A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH05251507A3</originalsourceid><addsrcrecordid>eNrjZOD2CvAwMDUyNTQ1MOdhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFIOhyNiVEDADvPG6E</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>JPH05251507</title><source>esp@cenet</source><creator>RAI AKITERU</creator><creatorcontrib>RAI AKITERU</creatorcontrib><description>PURPOSE:To form a fine solder dam and provide the reliability of a wiring part by providing a hole corresponding to the connecting pad of an electronic component and separately providing the films for the solder dam and for the wiring protection. CONSTITUTION:Metal wiring 2 is provided on a substrate 1, fine processing is performed by thinly forming photosensitive solder resist 3 on the connecting part of an electronic component and a hole 10 is formed to be a solder dam. Rather thin solder resist 4 is formed in an area other than the area close to the hole 10 and the wiring is protected. Since the films are separately used for the solder dam and for the wire protection, a highly reliable flip chip wiring substrate is formed while having the fine connecting pad.</description><edition>5</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930928&DB=EPODOC&CC=JP&NR=H05251507A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930928&DB=EPODOC&CC=JP&NR=H05251507A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAI AKITERU</creatorcontrib><title>JPH05251507</title><description>PURPOSE:To form a fine solder dam and provide the reliability of a wiring part by providing a hole corresponding to the connecting pad of an electronic component and separately providing the films for the solder dam and for the wiring protection. CONSTITUTION:Metal wiring 2 is provided on a substrate 1, fine processing is performed by thinly forming photosensitive solder resist 3 on the connecting part of an electronic component and a hole 10 is formed to be a solder dam. Rather thin solder resist 4 is formed in an area other than the area close to the hole 10 and the wiring is protected. Since the films are separately used for the solder dam and for the wire protection, a highly reliable flip chip wiring substrate is formed while having the fine connecting pad.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD2CvAwMDUyNTQ1MOdhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFIOhyNiVEDADvPG6E</recordid><startdate>19930928</startdate><enddate>19930928</enddate><creator>RAI AKITERU</creator><scope>EVB</scope></search><sort><creationdate>19930928</creationdate><title>JPH05251507</title><author>RAI AKITERU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH05251507A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>RAI AKITERU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAI AKITERU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JPH05251507</title><date>1993-09-28</date><risdate>1993</risdate><abstract>PURPOSE:To form a fine solder dam and provide the reliability of a wiring part by providing a hole corresponding to the connecting pad of an electronic component and separately providing the films for the solder dam and for the wiring protection. CONSTITUTION:Metal wiring 2 is provided on a substrate 1, fine processing is performed by thinly forming photosensitive solder resist 3 on the connecting part of an electronic component and a hole 10 is formed to be a solder dam. Rather thin solder resist 4 is formed in an area other than the area close to the hole 10 and the wiring is protected. Since the films are separately used for the solder dam and for the wire protection, a highly reliable flip chip wiring substrate is formed while having the fine connecting pad.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPH05251507A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | JPH05251507 |
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