CUTTING DEVICE FOR BRITTLE MATERIAL
PURPOSE:To improve the cutting accuracy and cutting efficiency of a wire saw. CONSTITUTION:A slit nozzle 7 of reverse T-shaped which is provided with a vertical processing-liquid-storage section 7-1 and a horizontal rectifying section 7-2 having an outlow opening of slit shape for flowing out the pr...
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| creator | MITANI MITSUO TOMIZAWA ATSUSHI |
| description | PURPOSE:To improve the cutting accuracy and cutting efficiency of a wire saw. CONSTITUTION:A slit nozzle 7 of reverse T-shaped which is provided with a vertical processing-liquid-storage section 7-1 and a horizontal rectifying section 7-2 having an outlow opening of slit shape for flowing out the processing-liquid in the horizontal direction just under a processing liquid feeding nozzle 4 of a wire saw in a manner that a wire line 2 runs through the rectifying section 7-2. The processing liquid is fed into the wire line 2 running through the rectifying section 7-2 of the slit nozzle 7 of T-shaped, and cutting is carried out in the state that the wire line is immersed in the processing liquid in the water curtain state in said rectifying section. |
| format | Patent |
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CONSTITUTION:A slit nozzle 7 of reverse T-shaped which is provided with a vertical processing-liquid-storage section 7-1 and a horizontal rectifying section 7-2 having an outlow opening of slit shape for flowing out the processing-liquid in the horizontal direction just under a processing liquid feeding nozzle 4 of a wire saw in a manner that a wire line 2 runs through the rectifying section 7-2. The processing liquid is fed into the wire line 2 running through the rectifying section 7-2 of the slit nozzle 7 of T-shaped, and cutting is carried out in the state that the wire line is immersed in the processing liquid in the water curtain state in said rectifying section.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930824&DB=EPODOC&CC=JP&NR=H05212720A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930824&DB=EPODOC&CC=JP&NR=H05212720A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MITANI MITSUO</creatorcontrib><creatorcontrib>TOMIZAWA ATSUSHI</creatorcontrib><title>CUTTING DEVICE FOR BRITTLE MATERIAL</title><description>PURPOSE:To improve the cutting accuracy and cutting efficiency of a wire saw. CONSTITUTION:A slit nozzle 7 of reverse T-shaped which is provided with a vertical processing-liquid-storage section 7-1 and a horizontal rectifying section 7-2 having an outlow opening of slit shape for flowing out the processing-liquid in the horizontal direction just under a processing liquid feeding nozzle 4 of a wire saw in a manner that a wire line 2 runs through the rectifying section 7-2. The processing liquid is fed into the wire line 2 running through the rectifying section 7-2 of the slit nozzle 7 of T-shaped, and cutting is carried out in the state that the wire line is immersed in the processing liquid in the water curtain state in said rectifying section.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB2Dg0J8fRzV3BxDfN0dlVw8w9ScAryDAnxcVXwdQxxDfJ09OFhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GpkaGRuZGBo7GxKgBAFhmIsw</recordid><startdate>19930824</startdate><enddate>19930824</enddate><creator>MITANI MITSUO</creator><creator>TOMIZAWA ATSUSHI</creator><scope>EVB</scope></search><sort><creationdate>19930824</creationdate><title>CUTTING DEVICE FOR BRITTLE MATERIAL</title><author>MITANI MITSUO ; TOMIZAWA ATSUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH05212720A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>MITANI MITSUO</creatorcontrib><creatorcontrib>TOMIZAWA ATSUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MITANI MITSUO</au><au>TOMIZAWA ATSUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CUTTING DEVICE FOR BRITTLE MATERIAL</title><date>1993-08-24</date><risdate>1993</risdate><abstract>PURPOSE:To improve the cutting accuracy and cutting efficiency of a wire saw. CONSTITUTION:A slit nozzle 7 of reverse T-shaped which is provided with a vertical processing-liquid-storage section 7-1 and a horizontal rectifying section 7-2 having an outlow opening of slit shape for flowing out the processing-liquid in the horizontal direction just under a processing liquid feeding nozzle 4 of a wire saw in a manner that a wire line 2 runs through the rectifying section 7-2. The processing liquid is fed into the wire line 2 running through the rectifying section 7-2 of the slit nozzle 7 of T-shaped, and cutting is carried out in the state that the wire line is immersed in the processing liquid in the water curtain state in said rectifying section.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPH05212720A |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | CUTTING DEVICE FOR BRITTLE MATERIAL |
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