ALIGNMENT MARK
PURPOSE:To cancel a situation that a positioning value can not be detected in a diffracted light detection alignment method, which is caused by the variation of process conditions such as level difference between marks or the thickness of an applied resist film. CONSTITUTION:It is ensured that a dif...
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| creator | SHIBA MASATAKA YOSHITAKE YASUHIRO |
| description | PURPOSE:To cancel a situation that a positioning value can not be detected in a diffracted light detection alignment method, which is caused by the variation of process conditions such as level difference between marks or the thickness of an applied resist film. CONSTITUTION:It is ensured that a diffracted light of over certain intensity is generated independent of the variation of processing conditions by an alignment mark 12 composed of mark element groups 21a, 21b, and 21c of various kinds where mark elements 20a, 20b, and 20c which are a1, a2, and a3 different from each other in size are arranged in the field of view of an alignment optical system keeping an arrangement pitch (b) constant. By this setup, a situation that a positioning value car not be detected due to the variation of process conditions is canceled, whereby a light exposure device can be automated or operated with no operator. |
| format | Patent |
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CONSTITUTION:It is ensured that a diffracted light of over certain intensity is generated independent of the variation of processing conditions by an alignment mark 12 composed of mark element groups 21a, 21b, and 21c of various kinds where mark elements 20a, 20b, and 20c which are a1, a2, and a3 different from each other in size are arranged in the field of view of an alignment optical system keeping an arrangement pitch (b) constant. By this setup, a situation that a positioning value car not be detected due to the variation of process conditions is canceled, whereby a light exposure device can be automated or operated with no operator.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930813&DB=EPODOC&CC=JP&NR=H05205995A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930813&DB=EPODOC&CC=JP&NR=H05205995A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIBA MASATAKA</creatorcontrib><creatorcontrib>YOSHITAKE YASUHIRO</creatorcontrib><title>ALIGNMENT MARK</title><description>PURPOSE:To cancel a situation that a positioning value can not be detected in a diffracted light detection alignment method, which is caused by the variation of process conditions such as level difference between marks or the thickness of an applied resist film. CONSTITUTION:It is ensured that a diffracted light of over certain intensity is generated independent of the variation of processing conditions by an alignment mark 12 composed of mark element groups 21a, 21b, and 21c of various kinds where mark elements 20a, 20b, and 20c which are a1, a2, and a3 different from each other in size are arranged in the field of view of an alignment optical system keeping an arrangement pitch (b) constant. By this setup, a situation that a positioning value car not be detected due to the variation of process conditions is canceled, whereby a light exposure device can be automated or operated with no operator.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBz9PF09_N19QtR8HUM8uZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GpkYGppaWpo7GxKgBAMqVHSc</recordid><startdate>19930813</startdate><enddate>19930813</enddate><creator>SHIBA MASATAKA</creator><creator>YOSHITAKE YASUHIRO</creator><scope>EVB</scope></search><sort><creationdate>19930813</creationdate><title>ALIGNMENT MARK</title><author>SHIBA MASATAKA ; YOSHITAKE YASUHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH05205995A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIBA MASATAKA</creatorcontrib><creatorcontrib>YOSHITAKE YASUHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIBA MASATAKA</au><au>YOSHITAKE YASUHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ALIGNMENT MARK</title><date>1993-08-13</date><risdate>1993</risdate><abstract>PURPOSE:To cancel a situation that a positioning value can not be detected in a diffracted light detection alignment method, which is caused by the variation of process conditions such as level difference between marks or the thickness of an applied resist film. CONSTITUTION:It is ensured that a diffracted light of over certain intensity is generated independent of the variation of processing conditions by an alignment mark 12 composed of mark element groups 21a, 21b, and 21c of various kinds where mark elements 20a, 20b, and 20c which are a1, a2, and a3 different from each other in size are arranged in the field of view of an alignment optical system keeping an arrangement pitch (b) constant. By this setup, a situation that a positioning value car not be detected due to the variation of process conditions is canceled, whereby a light exposure device can be automated or operated with no operator.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | ALIGNMENT MARK |
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