FILM CARRIER FOR TAB
PURPOSE:To make it unnecessary that a printed wiring board is connected to an outer lead part and to heighten reliability in connecting an inner lead part to an IC chip. CONSTITUTION:A wiring circuit 2 is arranged with a conductor on the surface of an insulating film 1 to form a film carrier 3. One...
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| creator | OTADA MASAMI WATABE SHINOBU MATSUI EITARO |
| description | PURPOSE:To make it unnecessary that a printed wiring board is connected to an outer lead part and to heighten reliability in connecting an inner lead part to an IC chip. CONSTITUTION:A wiring circuit 2 is arranged with a conductor on the surface of an insulating film 1 to form a film carrier 3. One end of the wiring circuit 2 is formed as an inner lead part 4 adhered to the surface of the insulating film 1. A bump is arranged on the surface of this inner lead part 4. The bump of the inner lead part 4 is connected to an electrode part of an IC chip 6 to mount the IC chip 6 on the film carrier 3. An outer lead part 7 formed on the wiring circuit 2 is connected to a receiving part 8, which is mounted on the film carrier 3. |
| format | Patent |
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CONSTITUTION:A wiring circuit 2 is arranged with a conductor on the surface of an insulating film 1 to form a film carrier 3. One end of the wiring circuit 2 is formed as an inner lead part 4 adhered to the surface of the insulating film 1. A bump is arranged on the surface of this inner lead part 4. The bump of the inner lead part 4 is connected to an electrode part of an IC chip 6 to mount the IC chip 6 on the film carrier 3. An outer lead part 7 formed on the wiring circuit 2 is connected to a receiving part 8, which is mounted on the film carrier 3.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930601&DB=EPODOC&CC=JP&NR=H05136203A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930601&DB=EPODOC&CC=JP&NR=H05136203A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OTADA MASAMI</creatorcontrib><creatorcontrib>WATABE SHINOBU</creatorcontrib><creatorcontrib>MATSUI EITARO</creatorcontrib><title>FILM CARRIER FOR TAB</title><description>PURPOSE:To make it unnecessary that a printed wiring board is connected to an outer lead part and to heighten reliability in connecting an inner lead part to an IC chip. 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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | FILM CARRIER FOR TAB |
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