PLATING DEVICE
PURPOSE:To obtain a plated surface of desired accuracy and desired plating thickness by automatically setting the prescribed plating current corresponding to the kinds and numbers of the materials to be plated in a plating cell and automatically controlling the plating time as well by computer contr...
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| creator | HASHIGUCHI YUJI |
| description | PURPOSE:To obtain a plated surface of desired accuracy and desired plating thickness by automatically setting the prescribed plating current corresponding to the kinds and numbers of the materials to be plated in a plating cell and automatically controlling the plating time as well by computer control. CONSTITUTION:A microprocessor 3 controls the feed of feed rollers and wires so as to attain the assigned plating time stored in a RAM 5 to advance lead frames 23 by each one from a charge port 26 into the plating cell 22 when the start of processing is assigned by the terminal equipment 6 of the computer 2. The frames 23 advancing into the plating cell 22 are detected by a frame detector 1. The number of the frames 23 in the plating cell 22 is detected in accordance with the detection signals thereof and the time from the detection. The value of the plating current assigned in accordance with the detected number of the frames 23 and the external data from a data line 9 is called out of the RAM 5. A current regulator 30a of a plating power source 30 is so controlled that the plating current of the set value flows between a meshed electrode and the leads of ICs. |
| format | Patent |
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CONSTITUTION:A microprocessor 3 controls the feed of feed rollers and wires so as to attain the assigned plating time stored in a RAM 5 to advance lead frames 23 by each one from a charge port 26 into the plating cell 22 when the start of processing is assigned by the terminal equipment 6 of the computer 2. The frames 23 advancing into the plating cell 22 are detected by a frame detector 1. The number of the frames 23 in the plating cell 22 is detected in accordance with the detection signals thereof and the time from the detection. The value of the plating current assigned in accordance with the detected number of the frames 23 and the external data from a data line 9 is called out of the RAM 5. A current regulator 30a of a plating power source 30 is so controlled that the plating current of the set value flows between a meshed electrode and the leads of ICs.</description><language>eng</language><subject>ANALOGUE COMPUTERS ; APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CALCULATING ; CHEMISTRY ; COMPUTING ; COUNTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PHYSICS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SEMICONDUCTOR DEVICES</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920310&DB=EPODOC&CC=JP&NR=H0474897A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920310&DB=EPODOC&CC=JP&NR=H0474897A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASHIGUCHI YUJI</creatorcontrib><title>PLATING DEVICE</title><description>PURPOSE:To obtain a plated surface of desired accuracy and desired plating thickness by automatically setting the prescribed plating current corresponding to the kinds and numbers of the materials to be plated in a plating cell and automatically controlling the plating time as well by computer control. CONSTITUTION:A microprocessor 3 controls the feed of feed rollers and wires so as to attain the assigned plating time stored in a RAM 5 to advance lead frames 23 by each one from a charge port 26 into the plating cell 22 when the start of processing is assigned by the terminal equipment 6 of the computer 2. The frames 23 advancing into the plating cell 22 are detected by a frame detector 1. The number of the frames 23 in the plating cell 22 is detected in accordance with the detection signals thereof and the time from the detection. The value of the plating current assigned in accordance with the detected number of the frames 23 and the external data from a data line 9 is called out of the RAM 5. A current regulator 30a of a plating power source 30 is so controlled that the plating current of the set value flows between a meshed electrode and the leads of ICs.</description><subject>ANALOGUE COMPUTERS</subject><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CHEMISTRY</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PHYSICS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAL8HEM8fRzV3BxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GJuYmFpbmjsZEKAEAkUUcwg</recordid><startdate>19920310</startdate><enddate>19920310</enddate><creator>HASHIGUCHI YUJI</creator><scope>EVB</scope></search><sort><creationdate>19920310</creationdate><title>PLATING DEVICE</title><author>HASHIGUCHI YUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0474897A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>ANALOGUE COMPUTERS</topic><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CHEMISTRY</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PHYSICS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HASHIGUCHI YUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HASHIGUCHI YUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PLATING DEVICE</title><date>1992-03-10</date><risdate>1992</risdate><abstract>PURPOSE:To obtain a plated surface of desired accuracy and desired plating thickness by automatically setting the prescribed plating current corresponding to the kinds and numbers of the materials to be plated in a plating cell and automatically controlling the plating time as well by computer control. CONSTITUTION:A microprocessor 3 controls the feed of feed rollers and wires so as to attain the assigned plating time stored in a RAM 5 to advance lead frames 23 by each one from a charge port 26 into the plating cell 22 when the start of processing is assigned by the terminal equipment 6 of the computer 2. The frames 23 advancing into the plating cell 22 are detected by a frame detector 1. The number of the frames 23 in the plating cell 22 is detected in accordance with the detection signals thereof and the time from the detection. The value of the plating current assigned in accordance with the detected number of the frames 23 and the external data from a data line 9 is called out of the RAM 5. A current regulator 30a of a plating power source 30 is so controlled that the plating current of the set value flows between a meshed electrode and the leads of ICs.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANALOGUE COMPUTERS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CALCULATING CHEMISTRY COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| title | PLATING DEVICE |
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