BONDING DEVICE

PURPOSE:To make it possible to clean completely all the outer peripheries of the side surface of a tool and the lower surface of the tool as well as to contrive the improvement of a cleaning efficiency. CONSTITUTION:A bonding device is provided with a bonding stage 7, on which a chip or the like is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SATO KIMIHARU, BANDO AKIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE:To make it possible to clean completely all the outer peripheries of the side surface of a tool and the lower surface of the tool as well as to contrive the improvement of a cleaning efficiency. CONSTITUTION:A bonding device is provided with a bonding stage 7, on which a chip or the like is positioned and placed, a tool 41 for making leads 40 of a film carrier pressure-weld to the chip or the like and a wire brush 74, which is provided in the vicinity of the stage 7 and cleans the tool 41. The brush 74 is mounted on the upper surface of a brush 71 beared rotatally around a vertical axis 72 and the plate 71 is rotated by a motor 77.