LASER BEAM MACHINE
PURPOSE:To allow laser beam machining which selectively uses profiling devices according to the material quality of a work to be machined. CONSTITUTION:The contact type profiling device 13 and the non-contact type profiling device 14 are provided in the laser beam machine 1. A machining condition fi...
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| creator | TASHIRO MINORU OCHIAI AKIYOSHI |
| description | PURPOSE:To allow laser beam machining which selectively uses profiling devices according to the material quality of a work to be machined. CONSTITUTION:The contact type profiling device 13 and the non-contact type profiling device 14 are provided in the laser beam machine 1. A machining condition file memory 33 in which the profiling conditions ND corresponding to the material quality of the work 19 are stored is provided. A machining control section 26 which reads out and outputs the profiling conditions ND is provided. A profiling device selection control section 30 which selectively uses these profiling devices by receiving the output from the machining control section 26 is provided. Since the machine is constituted in such a manner, either of the 1st profiling means and the 2nd profiling means is selectively used in correspondence to the work to be machined at the time of executing the laser beam machining using the profiling devices and, therefore, the laser beam machining which does not require the operation for remounting the profiling device according to the work to be machined is executed. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH04309483A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH04309483A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH04309483A3</originalsourceid><addsrcrecordid>eNrjZBDycQx2DVJwcnX0VfB1dPbw9HPlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBibGBpYmFsaOxsSoAQAlnh36</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LASER BEAM MACHINE</title><source>esp@cenet</source><creator>TASHIRO MINORU ; OCHIAI AKIYOSHI</creator><creatorcontrib>TASHIRO MINORU ; OCHIAI AKIYOSHI</creatorcontrib><description>PURPOSE:To allow laser beam machining which selectively uses profiling devices according to the material quality of a work to be machined. CONSTITUTION:The contact type profiling device 13 and the non-contact type profiling device 14 are provided in the laser beam machine 1. A machining condition file memory 33 in which the profiling conditions ND corresponding to the material quality of the work 19 are stored is provided. A machining control section 26 which reads out and outputs the profiling conditions ND is provided. A profiling device selection control section 30 which selectively uses these profiling devices by receiving the output from the machining control section 26 is provided. Since the machine is constituted in such a manner, either of the 1st profiling means and the 2nd profiling means is selectively used in correspondence to the work to be machined at the time of executing the laser beam machining using the profiling devices and, therefore, the laser beam machining which does not require the operation for remounting the profiling device according to the work to be machined is executed.</description><language>eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19921102&DB=EPODOC&CC=JP&NR=H04309483A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19921102&DB=EPODOC&CC=JP&NR=H04309483A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TASHIRO MINORU</creatorcontrib><creatorcontrib>OCHIAI AKIYOSHI</creatorcontrib><title>LASER BEAM MACHINE</title><description>PURPOSE:To allow laser beam machining which selectively uses profiling devices according to the material quality of a work to be machined. CONSTITUTION:The contact type profiling device 13 and the non-contact type profiling device 14 are provided in the laser beam machine 1. A machining condition file memory 33 in which the profiling conditions ND corresponding to the material quality of the work 19 are stored is provided. A machining control section 26 which reads out and outputs the profiling conditions ND is provided. A profiling device selection control section 30 which selectively uses these profiling devices by receiving the output from the machining control section 26 is provided. Since the machine is constituted in such a manner, either of the 1st profiling means and the 2nd profiling means is selectively used in correspondence to the work to be machined at the time of executing the laser beam machining using the profiling devices and, therefore, the laser beam machining which does not require the operation for remounting the profiling device according to the work to be machined is executed.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDycQx2DVJwcnX0VfB1dPbw9HPlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBibGBpYmFsaOxsSoAQAlnh36</recordid><startdate>19921102</startdate><enddate>19921102</enddate><creator>TASHIRO MINORU</creator><creator>OCHIAI AKIYOSHI</creator><scope>EVB</scope></search><sort><creationdate>19921102</creationdate><title>LASER BEAM MACHINE</title><author>TASHIRO MINORU ; OCHIAI AKIYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04309483A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>TASHIRO MINORU</creatorcontrib><creatorcontrib>OCHIAI AKIYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TASHIRO MINORU</au><au>OCHIAI AKIYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER BEAM MACHINE</title><date>1992-11-02</date><risdate>1992</risdate><abstract>PURPOSE:To allow laser beam machining which selectively uses profiling devices according to the material quality of a work to be machined. CONSTITUTION:The contact type profiling device 13 and the non-contact type profiling device 14 are provided in the laser beam machine 1. A machining condition file memory 33 in which the profiling conditions ND corresponding to the material quality of the work 19 are stored is provided. A machining control section 26 which reads out and outputs the profiling conditions ND is provided. A profiling device selection control section 30 which selectively uses these profiling devices by receiving the output from the machining control section 26 is provided. Since the machine is constituted in such a manner, either of the 1st profiling means and the 2nd profiling means is selectively used in correspondence to the work to be machined at the time of executing the laser beam machining using the profiling devices and, therefore, the laser beam machining which does not require the operation for remounting the profiling device according to the work to be machined is executed.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER BEAM MACHINE |
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