SEMICONDUCTOR DEVICE

PURPOSE:To acquire a semiconductor device which enables symmetric assembly to a package center by laying out arrangement of E, B bonding pads which attach to one adjacent active region, respectively symmetric to each dicing line on a wafer. CONSTITUTION:In a semiconductor device wherein a transistor chip 1 which is laid out on a wafer is used, E, B bonding pads 1a, 1b are arranged symmetric to a center line of an input/output lead 4 of a package. Therefore, it also becomes possible to carry out wire bonding of a connection fine line 3 symmetric right and left. Since the semiconductor device can be thereby assembled symmetric right and left to a center line of an inside thereof, it is possible to operate uniformly both right and left of the transistor chip 1 which consists of a long multi-active region and to prevent breakdown caused by irregularities of operation.