MOUNTING STRUCTURE OF ELECTRONIC COMPONENT

PURPOSE: To provide a mount structure which connects conductors fitted to a carrier at difference height positions to contact places on a flat substrate. CONSTITUTION: On a surface 1 of the substrate, connection parts 5, 6, and 7 in a swelled shape are formed and made tall enough to reach the height...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ROBAATO JIYOSEFU KERUHAA, TOOMASU MARIO SHIPORA, POORU UIRIAMU KOTEUSU, ROBAATO HENRII KATEIRU, POORU ANDORIYUU MOSUKOUITSUTSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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