MANUFACTURE OF PRINTED CIRCUIT BOARD

MANUFACTURE OF PRINTED CIRCUIT BOARD

PURPOSE:To eliminate occurrence of a malfunction due to presence of a foreign matter at the time of exposure when a circuit is formed of a positive type photoresist. CONSTITUTION:The surface of a metal layer 2 is coated with a positive type photoresist 3 by electrodepositing, a photomask 4 is superp...

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Hauptverfasser: NOBETANI TORU, FUKUSHIMA MUNEHIKO
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator NOBETANI TORU
FUKUSHIMA MUNEHIKO
description PURPOSE:To eliminate occurrence of a malfunction due to presence of a foreign matter at the time of exposure when a circuit is formed of a positive type photoresist. CONSTITUTION:The surface of a metal layer 2 is coated with a positive type photoresist 3 by electrodepositing, a photomask 4 is superposed on the photoresist 3, exposed, developed, the exposed part of the photoresist 3 is removed, and etched to form a circuit 6. In this case, the etching is overetched by using the photomask 4 formed by providing a mask line 5 in a width larger than that of the designed circuit 6. Even if the photoresist 3 remains at an undissolved part upon developing due to presence of a foreign matter in the case of exposure, the layer 2 of the lower side of the remaining part is dissolved to be removed by overetching.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH04250688A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH04250688A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH04250688A3</originalsourceid><addsrcrecordid>eNrjZFDxdfQLdXN0DgkNclXwd1MICPL0C3F1UXD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBiZGpgZmFhaOxsSoAQB_KyMw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MANUFACTURE OF PRINTED CIRCUIT BOARD</title><source>esp@cenet</source><creator>NOBETANI TORU ; FUKUSHIMA MUNEHIKO</creator><creatorcontrib>NOBETANI TORU ; FUKUSHIMA MUNEHIKO</creatorcontrib><description>PURPOSE:To eliminate occurrence of a malfunction due to presence of a foreign matter at the time of exposure when a circuit is formed of a positive type photoresist. CONSTITUTION:The surface of a metal layer 2 is coated with a positive type photoresist 3 by electrodepositing, a photomask 4 is superposed on the photoresist 3, exposed, developed, the exposed part of the photoresist 3 is removed, and etched to form a circuit 6. In this case, the etching is overetched by using the photomask 4 formed by providing a mask line 5 in a width larger than that of the designed circuit 6. Even if the photoresist 3 remains at an undissolved part upon developing due to presence of a foreign matter in the case of exposure, the layer 2 of the lower side of the remaining part is dissolved to be removed by overetching.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19920907&amp;DB=EPODOC&amp;CC=JP&amp;NR=H04250688A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19920907&amp;DB=EPODOC&amp;CC=JP&amp;NR=H04250688A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NOBETANI TORU</creatorcontrib><creatorcontrib>FUKUSHIMA MUNEHIKO</creatorcontrib><title>MANUFACTURE OF PRINTED CIRCUIT BOARD</title><description>PURPOSE:To eliminate occurrence of a malfunction due to presence of a foreign matter at the time of exposure when a circuit is formed of a positive type photoresist. CONSTITUTION:The surface of a metal layer 2 is coated with a positive type photoresist 3 by electrodepositing, a photomask 4 is superposed on the photoresist 3, exposed, developed, the exposed part of the photoresist 3 is removed, and etched to form a circuit 6. In this case, the etching is overetched by using the photomask 4 formed by providing a mask line 5 in a width larger than that of the designed circuit 6. Even if the photoresist 3 remains at an undissolved part upon developing due to presence of a foreign matter in the case of exposure, the layer 2 of the lower side of the remaining part is dissolved to be removed by overetching.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDxdfQLdXN0DgkNclXwd1MICPL0C3F1UXD2DHIO9QxRcPJ3DHLhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBiZGpgZmFhaOxsSoAQB_KyMw</recordid><startdate>19920907</startdate><enddate>19920907</enddate><creator>NOBETANI TORU</creator><creator>FUKUSHIMA MUNEHIKO</creator><scope>EVB</scope></search><sort><creationdate>19920907</creationdate><title>MANUFACTURE OF PRINTED CIRCUIT BOARD</title><author>NOBETANI TORU ; FUKUSHIMA MUNEHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04250688A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>NOBETANI TORU</creatorcontrib><creatorcontrib>FUKUSHIMA MUNEHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NOBETANI TORU</au><au>FUKUSHIMA MUNEHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF PRINTED CIRCUIT BOARD</title><date>1992-09-07</date><risdate>1992</risdate><abstract>PURPOSE:To eliminate occurrence of a malfunction due to presence of a foreign matter at the time of exposure when a circuit is formed of a positive type photoresist. CONSTITUTION:The surface of a metal layer 2 is coated with a positive type photoresist 3 by electrodepositing, a photomask 4 is superposed on the photoresist 3, exposed, developed, the exposed part of the photoresist 3 is removed, and etched to form a circuit 6. In this case, the etching is overetched by using the photomask 4 formed by providing a mask line 5 in a width larger than that of the designed circuit 6. Even if the photoresist 3 remains at an undissolved part upon developing due to presence of a foreign matter in the case of exposure, the layer 2 of the lower side of the remaining part is dissolved to be removed by overetching.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MANUFACTURE OF PRINTED CIRCUIT BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T04%3A47%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NOBETANI%20TORU&rft.date=1992-09-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH04250688A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true