METHOD OF CONNECTING OPERATION TESTER FOR PRINTED BOARD UNIT
PURPOSE:To facilitate connection and prevent foot pattern separation by connecting a relay printed board with a cable of an operation tester, coupling a coupling connector of an electric connection member with each printed board connector and jointing the tip of each conductor's foil exposed se...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NAKAGOME TAKASHI |
| description | PURPOSE:To facilitate connection and prevent foot pattern separation by connecting a relay printed board with a cable of an operation tester, coupling a coupling connector of an electric connection member with each printed board connector and jointing the tip of each conductor's foil exposed section of each electric connecting material with said foot pattern. CONSTITUTION:A main body 3-1 of an in-circuit emulator 3 is connected with a cable 3-3 by way of a pad 3-2 and one party of connector 14-3 of a relay printed board 14. At the same time, a coupling connector of an electric connection member 15 is coupled with each printed board connector 14-2 of the relay printed board 14 on the other side so that wiring may be laid out from the relay printed board 14 up to the printed board 1 by 4 electric connection members 15. Each tip of each electric connection member 15 is placed into contact with the foot pattern where the printed board 1 is connected with the in-circuit emulator by melting solder plating applied on the top of the foot pattern. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH04225600A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH04225600A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH04225600A3</originalsourceid><addsrcrecordid>eNrjZLDxdQ3x8HdR8HdTcPb383N1DvH0c1fwD3ANcgzx9PdTCHENDnENUnDzD1IICPL0C3F1UXDydwxyUQj18wzhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBiZGRqZmBgaOxsSoAQAKySm2</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF CONNECTING OPERATION TESTER FOR PRINTED BOARD UNIT</title><source>esp@cenet</source><creator>NAKAGOME TAKASHI</creator><creatorcontrib>NAKAGOME TAKASHI</creatorcontrib><description>PURPOSE:To facilitate connection and prevent foot pattern separation by connecting a relay printed board with a cable of an operation tester, coupling a coupling connector of an electric connection member with each printed board connector and jointing the tip of each conductor's foil exposed section of each electric connecting material with said foot pattern. CONSTITUTION:A main body 3-1 of an in-circuit emulator 3 is connected with a cable 3-3 by way of a pad 3-2 and one party of connector 14-3 of a relay printed board 14. At the same time, a coupling connector of an electric connection member 15 is coupled with each printed board connector 14-2 of the relay printed board 14 on the other side so that wiring may be laid out from the relay printed board 14 up to the printed board 1 by 4 electric connection members 15. Each tip of each electric connection member 15 is placed into contact with the foot pattern where the printed board 1 is connected with the in-circuit emulator by melting solder plating applied on the top of the foot pattern.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920814&DB=EPODOC&CC=JP&NR=H04225600A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920814&DB=EPODOC&CC=JP&NR=H04225600A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAGOME TAKASHI</creatorcontrib><title>METHOD OF CONNECTING OPERATION TESTER FOR PRINTED BOARD UNIT</title><description>PURPOSE:To facilitate connection and prevent foot pattern separation by connecting a relay printed board with a cable of an operation tester, coupling a coupling connector of an electric connection member with each printed board connector and jointing the tip of each conductor's foil exposed section of each electric connecting material with said foot pattern. CONSTITUTION:A main body 3-1 of an in-circuit emulator 3 is connected with a cable 3-3 by way of a pad 3-2 and one party of connector 14-3 of a relay printed board 14. At the same time, a coupling connector of an electric connection member 15 is coupled with each printed board connector 14-2 of the relay printed board 14 on the other side so that wiring may be laid out from the relay printed board 14 up to the printed board 1 by 4 electric connection members 15. Each tip of each electric connection member 15 is placed into contact with the foot pattern where the printed board 1 is connected with the in-circuit emulator by melting solder plating applied on the top of the foot pattern.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDxdQ3x8HdR8HdTcPb383N1DvH0c1fwD3ANcgzx9PdTCHENDnENUnDzD1IICPL0C3F1UXDydwxyUQj18wzhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBiZGRqZmBgaOxsSoAQAKySm2</recordid><startdate>19920814</startdate><enddate>19920814</enddate><creator>NAKAGOME TAKASHI</creator><scope>EVB</scope></search><sort><creationdate>19920814</creationdate><title>METHOD OF CONNECTING OPERATION TESTER FOR PRINTED BOARD UNIT</title><author>NAKAGOME TAKASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04225600A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAGOME TAKASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAGOME TAKASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF CONNECTING OPERATION TESTER FOR PRINTED BOARD UNIT</title><date>1992-08-14</date><risdate>1992</risdate><abstract>PURPOSE:To facilitate connection and prevent foot pattern separation by connecting a relay printed board with a cable of an operation tester, coupling a coupling connector of an electric connection member with each printed board connector and jointing the tip of each conductor's foil exposed section of each electric connecting material with said foot pattern. CONSTITUTION:A main body 3-1 of an in-circuit emulator 3 is connected with a cable 3-3 by way of a pad 3-2 and one party of connector 14-3 of a relay printed board 14. At the same time, a coupling connector of an electric connection member 15 is coupled with each printed board connector 14-2 of the relay printed board 14 on the other side so that wiring may be laid out from the relay printed board 14 up to the printed board 1 by 4 electric connection members 15. Each tip of each electric connection member 15 is placed into contact with the foot pattern where the printed board 1 is connected with the in-circuit emulator by melting solder plating applied on the top of the foot pattern.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH04225600A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING |
| title | METHOD OF CONNECTING OPERATION TESTER FOR PRINTED BOARD UNIT |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T06%3A39%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKAGOME%20TAKASHI&rft.date=1992-08-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH04225600A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |