MANUFACTURE OF ELECTRIC CIRCUIT BOARD
PURPOSE: To provide a method for manufacturing a print circuit board from a formed compound including polyarylene sulfide obtained by a specific surface processing using organic solvent, the circuit board obtained by this method, and the use of this circuit board. CONSTITUTION: The circuit board of...
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| creator | UDO BORUFU GIYUNTAA BAIMANSU |
| description | PURPOSE: To provide a method for manufacturing a print circuit board from a formed compound including polyarylene sulfide obtained by a specific surface processing using organic solvent, the circuit board obtained by this method, and the use of this circuit board. CONSTITUTION: The circuit board of a compound including polyarylene sulfide substantially having an amorphous surface is applied to the surface of a circuit board for bringing a reversible masking negative to metal as necessary, and then processed in non-protic organic liquid in a temperature to the glass temperature of a polyarylene sulfide formation compound used from 10 deg.C. Next, the metallic coating of the board is operated by the deposition of a corresponding metallic atom in a known method. |
| format | Patent |
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CONSTITUTION: The circuit board of a compound including polyarylene sulfide substantially having an amorphous surface is applied to the surface of a circuit board for bringing a reversible masking negative to metal as necessary, and then processed in non-protic organic liquid in a temperature to the glass temperature of a polyarylene sulfide formation compound used from 10 deg.C. 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CONSTITUTION: The circuit board of a compound including polyarylene sulfide substantially having an amorphous surface is applied to the surface of a circuit board for bringing a reversible masking negative to metal as necessary, and then processed in non-protic organic liquid in a temperature to the glass temperature of a polyarylene sulfide formation compound used from 10 deg.C. Next, the metallic coating of the board is operated by the deposition of a corresponding metallic atom in a known method.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD1dfQLdXN0DgkNclXwd1Nw9XF1DgnydFZw9gxyDvUMUXDydwxy4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgYmRkaGFhYGjsbEqAEAmWQjVg</recordid><startdate>19920812</startdate><enddate>19920812</enddate><creator>UDO BORUFU</creator><creator>GIYUNTAA BAIMANSU</creator><scope>EVB</scope></search><sort><creationdate>19920812</creationdate><title>MANUFACTURE OF ELECTRIC CIRCUIT BOARD</title><author>UDO BORUFU ; GIYUNTAA BAIMANSU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04221880A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>UDO BORUFU</creatorcontrib><creatorcontrib>GIYUNTAA BAIMANSU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UDO BORUFU</au><au>GIYUNTAA BAIMANSU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF ELECTRIC CIRCUIT BOARD</title><date>1992-08-12</date><risdate>1992</risdate><abstract>PURPOSE: To provide a method for manufacturing a print circuit board from a formed compound including polyarylene sulfide obtained by a specific surface processing using organic solvent, the circuit board obtained by this method, and the use of this circuit board. CONSTITUTION: The circuit board of a compound including polyarylene sulfide substantially having an amorphous surface is applied to the surface of a circuit board for bringing a reversible masking negative to metal as necessary, and then processed in non-protic organic liquid in a temperature to the glass temperature of a polyarylene sulfide formation compound used from 10 deg.C. Next, the metallic coating of the board is operated by the deposition of a corresponding metallic atom in a known method.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | MANUFACTURE OF ELECTRIC CIRCUIT BOARD |
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