PRINTED CIRCUIT BOARD AND CONNECTING PIN

PRINTED CIRCUIT BOARD AND CONNECTING PIN

PURPOSE:To increase the mounting density on a printed circuit board and facilitate manufacture by suching molten solder along the inner surface of a through hole and a connecting pin by means of capillary phenomenon, and connecting the wiring pattern on the board electrically through the molten sold...

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1. Verfasser: ASARI SHIGEATSU
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator ASARI SHIGEATSU
description PURPOSE:To increase the mounting density on a printed circuit board and facilitate manufacture by suching molten solder along the inner surface of a through hole and a connecting pin by means of capillary phenomenon, and connecting the wiring pattern on the board electrically through the molten solder. CONSTITUTION:When a printed circuit board 11 with a connection pin 15 inserted is dipped in a solder bath, the molten solder 16 is sucked up through the action of surface tension into the hollow 15c of the connection pin 15 from the undersurface of the circuit board 11 and leaks out onto the wiring pattern 12 from the folding part 15b of the connection pin 15. The leak solder 16 flows around along the periphery of the pin 15 and permeates the wiring pattern 12. Thereby the patterns 12, 13 are put in electrical connection through the molten solder 16 and connection pin 15. Thereby electrical connection can be made on both sides of a printed circuit board not having undergone a through hole processing, which permits mass-production of circuit boards at a low cost, and also the mounting density can be increased.
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CONSTITUTION:When a printed circuit board 11 with a connection pin 15 inserted is dipped in a solder bath, the molten solder 16 is sucked up through the action of surface tension into the hollow 15c of the connection pin 15 from the undersurface of the circuit board 11 and leaks out onto the wiring pattern 12 from the folding part 15b of the connection pin 15. The leak solder 16 flows around along the periphery of the pin 15 and permeates the wiring pattern 12. Thereby the patterns 12, 13 are put in electrical connection through the molten solder 16 and connection pin 15. 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CONSTITUTION:When a printed circuit board 11 with a connection pin 15 inserted is dipped in a solder bath, the molten solder 16 is sucked up through the action of surface tension into the hollow 15c of the connection pin 15 from the undersurface of the circuit board 11 and leaks out onto the wiring pattern 12 from the folding part 15b of the connection pin 15. The leak solder 16 flows around along the periphery of the pin 15 and permeates the wiring pattern 12. Thereby the patterns 12, 13 are put in electrical connection through the molten solder 16 and connection pin 15. Thereby electrical connection can be made on both sides of a printed circuit board not having undergone a through hole processing, which permits mass-production of circuit boards at a low cost, and also the mounting density can be increased.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED CIRCUIT BOARD AND CONNECTING PIN
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