SURFACE TREATMENT APPARATUS
PURPOSE:To obtain an apparatus which facilitates accurate control of replacement timings of dummy wafers, filler wafers and a reaction tube by a method wherein a frequency counter which counts the frequency of executed treatment cycles and a time counter which accumulates the actual operating hours...
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| creator | WAKASHIRO AKIYOSHI SAKAKIBARA ATSUYUKI |
| description | PURPOSE:To obtain an apparatus which facilitates accurate control of replacement timings of dummy wafers, filler wafers and a reaction tube by a method wherein a frequency counter which counts the frequency of executed treatment cycles and a time counter which accumulates the actual operating hours of a treatment unit are provided in a sequencer, etc. CONSTITUTION:Shelves allocated to product wafers WP and shelves allocated to dummy wafers WD are provided. If there are vacant shelves in a boat 17 transferred into the reaction tube 15 of a treatment unit, the vacant shelves are filled with filler wafers WD. A sequencer 30 has a frequency counter 35 which counts the frequency of executed treatment cycles and a time counter 36 which accumulates the actual operating hours of the treatment unit. If the counted value of the frequency counter 35 reaches the upper limit of the dummy wafer usage frequency, a dummy wafer cassette replacement command is generated and, if the counted value reaches the upper limit of the filler wafer usage frequency, a filler wafer cassette replacement command is generated. If the accumulated value of the time counter 36 reaches the upper limit of the operating hours of the treatment unit, a reaction tube replacement command is generated. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH04206714A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH04206714A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH04206714A3</originalsourceid><addsrcrecordid>eNrjZJAODg1yc3R2VQgJcnUM8XX1C1FwDAhwDHIMCQ3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBiZGBmbmhiaOxsSoAQBocCDi</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SURFACE TREATMENT APPARATUS</title><source>esp@cenet</source><creator>WAKASHIRO AKIYOSHI ; SAKAKIBARA ATSUYUKI</creator><creatorcontrib>WAKASHIRO AKIYOSHI ; SAKAKIBARA ATSUYUKI</creatorcontrib><description>PURPOSE:To obtain an apparatus which facilitates accurate control of replacement timings of dummy wafers, filler wafers and a reaction tube by a method wherein a frequency counter which counts the frequency of executed treatment cycles and a time counter which accumulates the actual operating hours of a treatment unit are provided in a sequencer, etc. CONSTITUTION:Shelves allocated to product wafers WP and shelves allocated to dummy wafers WD are provided. If there are vacant shelves in a boat 17 transferred into the reaction tube 15 of a treatment unit, the vacant shelves are filled with filler wafers WD. A sequencer 30 has a frequency counter 35 which counts the frequency of executed treatment cycles and a time counter 36 which accumulates the actual operating hours of the treatment unit. If the counted value of the frequency counter 35 reaches the upper limit of the dummy wafer usage frequency, a dummy wafer cassette replacement command is generated and, if the counted value reaches the upper limit of the filler wafer usage frequency, a filler wafer cassette replacement command is generated. If the accumulated value of the time counter 36 reaches the upper limit of the operating hours of the treatment unit, a reaction tube replacement command is generated.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920728&DB=EPODOC&CC=JP&NR=H04206714A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920728&DB=EPODOC&CC=JP&NR=H04206714A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WAKASHIRO AKIYOSHI</creatorcontrib><creatorcontrib>SAKAKIBARA ATSUYUKI</creatorcontrib><title>SURFACE TREATMENT APPARATUS</title><description>PURPOSE:To obtain an apparatus which facilitates accurate control of replacement timings of dummy wafers, filler wafers and a reaction tube by a method wherein a frequency counter which counts the frequency of executed treatment cycles and a time counter which accumulates the actual operating hours of a treatment unit are provided in a sequencer, etc. CONSTITUTION:Shelves allocated to product wafers WP and shelves allocated to dummy wafers WD are provided. If there are vacant shelves in a boat 17 transferred into the reaction tube 15 of a treatment unit, the vacant shelves are filled with filler wafers WD. A sequencer 30 has a frequency counter 35 which counts the frequency of executed treatment cycles and a time counter 36 which accumulates the actual operating hours of the treatment unit. If the counted value of the frequency counter 35 reaches the upper limit of the dummy wafer usage frequency, a dummy wafer cassette replacement command is generated and, if the counted value reaches the upper limit of the filler wafer usage frequency, a filler wafer cassette replacement command is generated. If the accumulated value of the time counter 36 reaches the upper limit of the operating hours of the treatment unit, a reaction tube replacement command is generated.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAODg1yc3R2VQgJcnUM8XX1C1FwDAhwDHIMCQ3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBiZGBmbmhiaOxsSoAQBocCDi</recordid><startdate>19920728</startdate><enddate>19920728</enddate><creator>WAKASHIRO AKIYOSHI</creator><creator>SAKAKIBARA ATSUYUKI</creator><scope>EVB</scope></search><sort><creationdate>19920728</creationdate><title>SURFACE TREATMENT APPARATUS</title><author>WAKASHIRO AKIYOSHI ; SAKAKIBARA ATSUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04206714A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>WAKASHIRO AKIYOSHI</creatorcontrib><creatorcontrib>SAKAKIBARA ATSUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WAKASHIRO AKIYOSHI</au><au>SAKAKIBARA ATSUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE TREATMENT APPARATUS</title><date>1992-07-28</date><risdate>1992</risdate><abstract>PURPOSE:To obtain an apparatus which facilitates accurate control of replacement timings of dummy wafers, filler wafers and a reaction tube by a method wherein a frequency counter which counts the frequency of executed treatment cycles and a time counter which accumulates the actual operating hours of a treatment unit are provided in a sequencer, etc. CONSTITUTION:Shelves allocated to product wafers WP and shelves allocated to dummy wafers WD are provided. If there are vacant shelves in a boat 17 transferred into the reaction tube 15 of a treatment unit, the vacant shelves are filled with filler wafers WD. A sequencer 30 has a frequency counter 35 which counts the frequency of executed treatment cycles and a time counter 36 which accumulates the actual operating hours of the treatment unit. If the counted value of the frequency counter 35 reaches the upper limit of the dummy wafer usage frequency, a dummy wafer cassette replacement command is generated and, if the counted value reaches the upper limit of the filler wafer usage frequency, a filler wafer cassette replacement command is generated. If the accumulated value of the time counter 36 reaches the upper limit of the operating hours of the treatment unit, a reaction tube replacement command is generated.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SURFACE TREATMENT APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T20%3A49%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WAKASHIRO%20AKIYOSHI&rft.date=1992-07-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH04206714A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |