FALLING-OFF PREVENTING METHOD OF ELECTRONIC COMPONENTS
PURPOSE:To prevent the falling-off of an electronic component by applying a solder promoting agent which has an adhesion power and enhances the wettability of solder at a position where paste like solder is printed. CONSTITUTION:Cream solder 3 is printed on a wiring pattern 4 at a specified position...
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| creator | SATOMI KUNIO NAKASAKI YOSHIHIKO |
| description | PURPOSE:To prevent the falling-off of an electronic component by applying a solder promoting agent which has an adhesion power and enhances the wettability of solder at a position where paste like solder is printed. CONSTITUTION:Cream solder 3 is printed on a wiring pattern 4 at a specified position where the top of the printed cream solder 3 is coated with a solder promoting agent 2. The solder promoting agent 2 is designed to have an adhesion power and enhance the wettability of solder. After the solder promoting agent 2 is coated, a chip electronic component 1 is immediately mounted at a specified position. More specifically, it is mounted in such a manner that an electrode 6 of the chip electronic component 1 may come into face contact with a part on the top of the solder 3. This construction makes it possible to hold the chip electronic component 1 on a board 5 to a satisfactory extent and thereby prevent the falling-off of components. |
| format | Patent |
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CONSTITUTION:Cream solder 3 is printed on a wiring pattern 4 at a specified position where the top of the printed cream solder 3 is coated with a solder promoting agent 2. The solder promoting agent 2 is designed to have an adhesion power and enhance the wettability of solder. After the solder promoting agent 2 is coated, a chip electronic component 1 is immediately mounted at a specified position. More specifically, it is mounted in such a manner that an electrode 6 of the chip electronic component 1 may come into face contact with a part on the top of the solder 3. This construction makes it possible to hold the chip electronic component 1 on a board 5 to a satisfactory extent and thereby prevent the falling-off of components.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920525&DB=EPODOC&CC=JP&NR=H04151893A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920525&DB=EPODOC&CC=JP&NR=H04151893A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SATOMI KUNIO</creatorcontrib><creatorcontrib>NAKASAKI YOSHIHIKO</creatorcontrib><title>FALLING-OFF PREVENTING METHOD OF ELECTRONIC COMPONENTS</title><description>PURPOSE:To prevent the falling-off of an electronic component by applying a solder promoting agent which has an adhesion power and enhances the wettability of solder at a position where paste like solder is printed. CONSTITUTION:Cream solder 3 is printed on a wiring pattern 4 at a specified position where the top of the printed cream solder 3 is coated with a solder promoting agent 2. The solder promoting agent 2 is designed to have an adhesion power and enhance the wettability of solder. After the solder promoting agent 2 is coated, a chip electronic component 1 is immediately mounted at a specified position. More specifically, it is mounted in such a manner that an electrode 6 of the chip electronic component 1 may come into face contact with a part on the top of the solder 3. This construction makes it possible to hold the chip electronic component 1 on a board 5 to a satisfactory extent and thereby prevent the falling-off of components.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBzc_Tx8fRz1_V3c1MICHINc_ULAXIVfF1DPPxdFPzdFFx9XJ1Dgvz9PJ0VnP19A_z9gCqCeRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvFeAh4GJoamhhaWxozExagAk4ShI</recordid><startdate>19920525</startdate><enddate>19920525</enddate><creator>SATOMI KUNIO</creator><creator>NAKASAKI YOSHIHIKO</creator><scope>EVB</scope></search><sort><creationdate>19920525</creationdate><title>FALLING-OFF PREVENTING METHOD OF ELECTRONIC COMPONENTS</title><author>SATOMI KUNIO ; NAKASAKI YOSHIHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04151893A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SATOMI KUNIO</creatorcontrib><creatorcontrib>NAKASAKI YOSHIHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SATOMI KUNIO</au><au>NAKASAKI YOSHIHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FALLING-OFF PREVENTING METHOD OF ELECTRONIC COMPONENTS</title><date>1992-05-25</date><risdate>1992</risdate><abstract>PURPOSE:To prevent the falling-off of an electronic component by applying a solder promoting agent which has an adhesion power and enhances the wettability of solder at a position where paste like solder is printed. CONSTITUTION:Cream solder 3 is printed on a wiring pattern 4 at a specified position where the top of the printed cream solder 3 is coated with a solder promoting agent 2. The solder promoting agent 2 is designed to have an adhesion power and enhance the wettability of solder. After the solder promoting agent 2 is coated, a chip electronic component 1 is immediately mounted at a specified position. More specifically, it is mounted in such a manner that an electrode 6 of the chip electronic component 1 may come into face contact with a part on the top of the solder 3. This construction makes it possible to hold the chip electronic component 1 on a board 5 to a satisfactory extent and thereby prevent the falling-off of components.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | FALLING-OFF PREVENTING METHOD OF ELECTRONIC COMPONENTS |
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