PASTING METHOD FOR CUT PIECE OF ADHESIVE SHEET

PASTING METHOD FOR CUT PIECE OF ADHESIVE SHEET

PURPOSE:To facilitate smooth removal work by attaching an adhesive layer and mold release processing sheet on one side of base sheet whereinto a cutting wire in a specified shape is inserted, separating the mold release processing sheet of the part of the specified shape to stick it to the surface t...

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Hauptverfasser: IGARASHI MASAMORI, TAMURA TSUTOMU
Format: Patent
Sprache:eng
Schlagworte:
CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
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creator IGARASHI MASAMORI
TAMURA TSUTOMU
description PURPOSE:To facilitate smooth removal work by attaching an adhesive layer and mold release processing sheet on one side of base sheet whereinto a cutting wire in a specified shape is inserted, separating the mold release processing sheet of the part of the specified shape to stick it to the surface to be attached to support it, and removing the mold release processing sheet. CONSTITUTION:In adhesive sheet, an adhesive agent 2 is applied to one side of a base sheet 1, and mold release processing sheet 3 is attached to an adhesive layer 2. Cutting wires 11 in a specified shape are inserted in the base sheet 1 of the adhesive sheet and the part of mold release processing sheet 3 facing that specified shape part is peeled off to expose the adhesive layer 2. Adhesive sheet processed like this is placed on a commodity 4, alignment of positions of the base sheet part 1A whereinto the cutting wire 11 is inserted and the masking part A of the commodity 4 is performed, and the exposed adhesive layer part 2A of the base sheet part 1A is pasted to the masking part A of the commodity 4. Then, other part B than the part B bonded to the commodity 4 is pulled and removed. Since the part B of the adhesive sheet to be removed is not sticked to the commodity 4, the part B of the adhesive sheet can be removed only by cutting the cutting wires 11 of the base sheet 1.
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CONSTITUTION:In adhesive sheet, an adhesive agent 2 is applied to one side of a base sheet 1, and mold release processing sheet 3 is attached to an adhesive layer 2. Cutting wires 11 in a specified shape are inserted in the base sheet 1 of the adhesive sheet and the part of mold release processing sheet 3 facing that specified shape part is peeled off to expose the adhesive layer 2. Adhesive sheet processed like this is placed on a commodity 4, alignment of positions of the base sheet part 1A whereinto the cutting wire 11 is inserted and the masking part A of the commodity 4 is performed, and the exposed adhesive layer part 2A of the base sheet part 1A is pasted to the masking part A of the commodity 4. Then, other part B than the part B bonded to the commodity 4 is pulled and removed. Since the part B of the adhesive sheet to be removed is not sticked to the commodity 4, the part B of the adhesive sheet can be removed only by cutting the cutting wires 11 of the base sheet 1.</description><language>eng</language><subject>CONVEYING ; HANDLING THIN OR FILAMENTARY MATERIAL ; HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES ; PACKING ; PERFORMING OPERATIONS ; STORING ; TRANSPORTING</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19920507&amp;DB=EPODOC&amp;CC=JP&amp;NR=H04133964A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19920507&amp;DB=EPODOC&amp;CC=JP&amp;NR=H04133964A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IGARASHI MASAMORI</creatorcontrib><creatorcontrib>TAMURA TSUTOMU</creatorcontrib><title>PASTING METHOD FOR CUT PIECE OF ADHESIVE SHEET</title><description>PURPOSE:To facilitate smooth removal work by attaching an adhesive layer and mold release processing sheet on one side of base sheet whereinto a cutting wire in a specified shape is inserted, separating the mold release processing sheet of the part of the specified shape to stick it to the surface to be attached to support it, and removing the mold release processing sheet. 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CONSTITUTION:In adhesive sheet, an adhesive agent 2 is applied to one side of a base sheet 1, and mold release processing sheet 3 is attached to an adhesive layer 2. Cutting wires 11 in a specified shape are inserted in the base sheet 1 of the adhesive sheet and the part of mold release processing sheet 3 facing that specified shape part is peeled off to expose the adhesive layer 2. Adhesive sheet processed like this is placed on a commodity 4, alignment of positions of the base sheet part 1A whereinto the cutting wire 11 is inserted and the masking part A of the commodity 4 is performed, and the exposed adhesive layer part 2A of the base sheet part 1A is pasted to the masking part A of the commodity 4. Then, other part B than the part B bonded to the commodity 4 is pulled and removed. Since the part B of the adhesive sheet to be removed is not sticked to the commodity 4, the part B of the adhesive sheet can be removed only by cutting the cutting wires 11 of the base sheet 1.</abstract><oa>free_for_read</oa></addata></record>
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subjects CONVEYING
HANDLING THIN OR FILAMENTARY MATERIAL
HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES
PACKING
PERFORMING OPERATIONS
STORING
TRANSPORTING
title PASTING METHOD FOR CUT PIECE OF ADHESIVE SHEET
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