WIRE-SAW FOR CUTTING WAFER FROM BAR OR BLOCK-LIKE WORKPIECE

PURPOSE: To very accurately cut a wafer even when a workpiece format changes by additionally and respectively arranging a single undriven auxiliary guide roller on both sides of the wire part in contact with a workpiece between deflective rollers to demarcate a sawing area. CONSTITUTION: At least a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAARU EGURUFUUBAA, DEIITAA ZAIFUERUTO
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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