ETCHING LIQUID CONTROLLING APPARATUS
PURPOSE:To stabilize etching liquid by periodically measuring concentration of acid of a copper etching liquid to correct and control an output of chlorine ion electrode. CONSTITUTION:An ORP electrode 3 and chlorine ion electrode 4 are immersed in an etching liquid 2 and a hydrometer 6 and a thermom...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ASANO TOMOAKI |
| description | PURPOSE:To stabilize etching liquid by periodically measuring concentration of acid of a copper etching liquid to correct and control an output of chlorine ion electrode. CONSTITUTION:An ORP electrode 3 and chlorine ion electrode 4 are immersed in an etching liquid 2 and a hydrometer 6 and a thermometer 6 are provided to measure a specific gravity and temperature of the etching liquid 2. Outputs of these sensors are inputted to a comparator 8 and are compared with preset values. On the other hand, the sampling liquid from a sampler 10 is measured with a pH automatic titlator 11 for detecting concentration of acid. A compensating section 12 compares an output of the pH automatic titlator 11 with an output of the chlorine ion electrode to calculate a difference and outputs a compensated preset value to a comparator 8d. The pH automatic titlator 11 operates in the predetermined period and periodically repeats the calibrating operation of an output of the chlorine ion electrode. With an output of the comparator 8, a drive 13 operates a pump 15 to supply the supplemental liquid 14 to a tank la, in order to adjust temperature of the liquid 2 with a temperature controller 16. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH04122090A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH04122090A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH04122090A3</originalsourceid><addsrcrecordid>eNrjZFBxDXH28PRzV_DxDAz1dFFw9vcLCfL38QEJOQYEOAY5hoQG8zCwpiXmFKfyQmluBkU3kD7d1IL8-NTigsTk1LzUknivAA8DE0MjIwNLA0djYtQAAJT5I1c</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ETCHING LIQUID CONTROLLING APPARATUS</title><source>esp@cenet</source><creator>ASANO TOMOAKI</creator><creatorcontrib>ASANO TOMOAKI</creatorcontrib><description>PURPOSE:To stabilize etching liquid by periodically measuring concentration of acid of a copper etching liquid to correct and control an output of chlorine ion electrode. CONSTITUTION:An ORP electrode 3 and chlorine ion electrode 4 are immersed in an etching liquid 2 and a hydrometer 6 and a thermometer 6 are provided to measure a specific gravity and temperature of the etching liquid 2. Outputs of these sensors are inputted to a comparator 8 and are compared with preset values. On the other hand, the sampling liquid from a sampler 10 is measured with a pH automatic titlator 11 for detecting concentration of acid. A compensating section 12 compares an output of the pH automatic titlator 11 with an output of the chlorine ion electrode to calculate a difference and outputs a compensated preset value to a comparator 8d. The pH automatic titlator 11 operates in the predetermined period and periodically repeats the calibrating operation of an output of the chlorine ion electrode. With an output of the comparator 8, a drive 13 operates a pump 15 to supply the supplemental liquid 14 to a tank la, in order to adjust temperature of the liquid 2 with a temperature controller 16.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PRINTED CIRCUITS</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920422&DB=EPODOC&CC=JP&NR=H04122090A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920422&DB=EPODOC&CC=JP&NR=H04122090A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ASANO TOMOAKI</creatorcontrib><title>ETCHING LIQUID CONTROLLING APPARATUS</title><description>PURPOSE:To stabilize etching liquid by periodically measuring concentration of acid of a copper etching liquid to correct and control an output of chlorine ion electrode. CONSTITUTION:An ORP electrode 3 and chlorine ion electrode 4 are immersed in an etching liquid 2 and a hydrometer 6 and a thermometer 6 are provided to measure a specific gravity and temperature of the etching liquid 2. Outputs of these sensors are inputted to a comparator 8 and are compared with preset values. On the other hand, the sampling liquid from a sampler 10 is measured with a pH automatic titlator 11 for detecting concentration of acid. A compensating section 12 compares an output of the pH automatic titlator 11 with an output of the chlorine ion electrode to calculate a difference and outputs a compensated preset value to a comparator 8d. The pH automatic titlator 11 operates in the predetermined period and periodically repeats the calibrating operation of an output of the chlorine ion electrode. With an output of the comparator 8, a drive 13 operates a pump 15 to supply the supplemental liquid 14 to a tank la, in order to adjust temperature of the liquid 2 with a temperature controller 16.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBxDXH28PRzV_DxDAz1dFFw9vcLCfL38QEJOQYEOAY5hoQG8zCwpiXmFKfyQmluBkU3kD7d1IL8-NTigsTk1LzUknivAA8DE0MjIwNLA0djYtQAAJT5I1c</recordid><startdate>19920422</startdate><enddate>19920422</enddate><creator>ASANO TOMOAKI</creator><scope>EVB</scope></search><sort><creationdate>19920422</creationdate><title>ETCHING LIQUID CONTROLLING APPARATUS</title><author>ASANO TOMOAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04122090A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ASANO TOMOAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ASANO TOMOAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ETCHING LIQUID CONTROLLING APPARATUS</title><date>1992-04-22</date><risdate>1992</risdate><abstract>PURPOSE:To stabilize etching liquid by periodically measuring concentration of acid of a copper etching liquid to correct and control an output of chlorine ion electrode. CONSTITUTION:An ORP electrode 3 and chlorine ion electrode 4 are immersed in an etching liquid 2 and a hydrometer 6 and a thermometer 6 are provided to measure a specific gravity and temperature of the etching liquid 2. Outputs of these sensors are inputted to a comparator 8 and are compared with preset values. On the other hand, the sampling liquid from a sampler 10 is measured with a pH automatic titlator 11 for detecting concentration of acid. A compensating section 12 compares an output of the pH automatic titlator 11 with an output of the chlorine ion electrode to calculate a difference and outputs a compensated preset value to a comparator 8d. The pH automatic titlator 11 operates in the predetermined period and periodically repeats the calibrating operation of an output of the chlorine ion electrode. With an output of the comparator 8, a drive 13 operates a pump 15 to supply the supplemental liquid 14 to a tank la, in order to adjust temperature of the liquid 2 with a temperature controller 16.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH04122090A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS |
| title | ETCHING LIQUID CONTROLLING APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T08%3A00%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ASANO%20TOMOAKI&rft.date=1992-04-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH04122090A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |