RESIST APPLICATOR
PURPOSE:To prevent generation in a wafer of a resist clam when a resist is applied, and to obviate the cracking of the wafer by mounting a wafer holder, which is composed of an elastic body, an area of which is made larger than that of the semiconductor wafer and which has a recessed section. CONSTI...
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| creator | HIGUCHI HIDEYO |
| description | PURPOSE:To prevent generation in a wafer of a resist clam when a resist is applied, and to obviate the cracking of the wafer by mounting a wafer holder, which is composed of an elastic body, an area of which is made larger than that of the semiconductor wafer and which has a recessed section. CONSTITUTION:A wafer holder 3, which has an area larger than that of a semiconductor wafer 1, to which a recessed section 3a is formed and which consists of an elastic body, is installed. The area of the recessed section 3a is made smaller than that of the wafer 1, no groove is formed when the wafer 1 is inserted, and form tolerance can be absorbed while depth is shaped in depth as the same plane of the top face of the wafer 1 and the top face of the holder 3. The wafer 1 is inserted into the recessed section 3a, the top face of the wafer 1 is formed in the same plane as the holder 3, the holder 3 is set to a spinner head 4, and the wafer 1 is coated with a resist 2. when the resist 2 uniformly spreads in the surface of the wafer 1 at that time a resist dam 2a is not formed to the wafer 1, and is formed to the peripheral section of the holder 3. Accordingly, even when exposure is conducted by using a contact type mask aligner, the generation of the cracking of the wafer can be prevented. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0411721A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0411721A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0411721A3</originalsourceid><addsrcrecordid>eNrjZBAMcg32DA5RcAwI8PF0dgzxD-JhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GJoaG5kaGjsZEKAEA9qIdoQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RESIST APPLICATOR</title><source>esp@cenet</source><creator>HIGUCHI HIDEYO</creator><creatorcontrib>HIGUCHI HIDEYO</creatorcontrib><description>PURPOSE:To prevent generation in a wafer of a resist clam when a resist is applied, and to obviate the cracking of the wafer by mounting a wafer holder, which is composed of an elastic body, an area of which is made larger than that of the semiconductor wafer and which has a recessed section. CONSTITUTION:A wafer holder 3, which has an area larger than that of a semiconductor wafer 1, to which a recessed section 3a is formed and which consists of an elastic body, is installed. The area of the recessed section 3a is made smaller than that of the wafer 1, no groove is formed when the wafer 1 is inserted, and form tolerance can be absorbed while depth is shaped in depth as the same plane of the top face of the wafer 1 and the top face of the holder 3. The wafer 1 is inserted into the recessed section 3a, the top face of the wafer 1 is formed in the same plane as the holder 3, the holder 3 is set to a spinner head 4, and the wafer 1 is coated with a resist 2. when the resist 2 uniformly spreads in the surface of the wafer 1 at that time a resist dam 2a is not formed to the wafer 1, and is formed to the peripheral section of the holder 3. Accordingly, even when exposure is conducted by using a contact type mask aligner, the generation of the cracking of the wafer can be prevented.</description><language>eng</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPARATUS SPECIALLY ADAPTED THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920116&DB=EPODOC&CC=JP&NR=H0411721A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920116&DB=EPODOC&CC=JP&NR=H0411721A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIGUCHI HIDEYO</creatorcontrib><title>RESIST APPLICATOR</title><description>PURPOSE:To prevent generation in a wafer of a resist clam when a resist is applied, and to obviate the cracking of the wafer by mounting a wafer holder, which is composed of an elastic body, an area of which is made larger than that of the semiconductor wafer and which has a recessed section. CONSTITUTION:A wafer holder 3, which has an area larger than that of a semiconductor wafer 1, to which a recessed section 3a is formed and which consists of an elastic body, is installed. The area of the recessed section 3a is made smaller than that of the wafer 1, no groove is formed when the wafer 1 is inserted, and form tolerance can be absorbed while depth is shaped in depth as the same plane of the top face of the wafer 1 and the top face of the holder 3. The wafer 1 is inserted into the recessed section 3a, the top face of the wafer 1 is formed in the same plane as the holder 3, the holder 3 is set to a spinner head 4, and the wafer 1 is coated with a resist 2. when the resist 2 uniformly spreads in the surface of the wafer 1 at that time a resist dam 2a is not formed to the wafer 1, and is formed to the peripheral section of the holder 3. Accordingly, even when exposure is conducted by using a contact type mask aligner, the generation of the cracking of the wafer can be prevented.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMcg32DA5RcAwI8PF0dgzxD-JhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GJoaG5kaGjsZEKAEA9qIdoQ</recordid><startdate>19920116</startdate><enddate>19920116</enddate><creator>HIGUCHI HIDEYO</creator><scope>EVB</scope></search><sort><creationdate>19920116</creationdate><title>RESIST APPLICATOR</title><author>HIGUCHI HIDEYO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0411721A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HIGUCHI HIDEYO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIGUCHI HIDEYO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIST APPLICATOR</title><date>1992-01-16</date><risdate>1992</risdate><abstract>PURPOSE:To prevent generation in a wafer of a resist clam when a resist is applied, and to obviate the cracking of the wafer by mounting a wafer holder, which is composed of an elastic body, an area of which is made larger than that of the semiconductor wafer and which has a recessed section. CONSTITUTION:A wafer holder 3, which has an area larger than that of a semiconductor wafer 1, to which a recessed section 3a is formed and which consists of an elastic body, is installed. The area of the recessed section 3a is made smaller than that of the wafer 1, no groove is formed when the wafer 1 is inserted, and form tolerance can be absorbed while depth is shaped in depth as the same plane of the top face of the wafer 1 and the top face of the holder 3. The wafer 1 is inserted into the recessed section 3a, the top face of the wafer 1 is formed in the same plane as the holder 3, the holder 3 is set to a spinner head 4, and the wafer 1 is coated with a resist 2. when the resist 2 uniformly spreads in the surface of the wafer 1 at that time a resist dam 2a is not formed to the wafer 1, and is formed to the peripheral section of the holder 3. Accordingly, even when exposure is conducted by using a contact type mask aligner, the generation of the cracking of the wafer can be prevented.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | RESIST APPLICATOR |
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