PROTECTIVE SYSTEM OF PRINTED BOARD
PURPOSE:To protect a printed board simply, and to remove parts even after assembly by mounting the part for insulation having a reflow pad higher than the part mounted to the printed board or an exposed electrode section and having the same shape as a chip part. CONSTITUTION:When an electronic part...
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creator | HIRAMATSU KATSUHIRO |
description | PURPOSE:To protect a printed board simply, and to remove parts even after assembly by mounting the part for insulation having a reflow pad higher than the part mounted to the printed board or an exposed electrode section and having the same shape as a chip part. CONSTITUTION:When an electronic part is mounted to a printed board, parts 3 for insulation having reflow pads having the same shape as chip parts are mounted and soldered to pads previously shaped at the four ends of the printed board as well as other chip parts. Consequently, since the height of the parts 3 for insulation is made higher than that of the electronic parts 4 mounted to the printed board and electrode sections 5 exposed from the printed board, the parts 3 support the printed board, and protect the electronic parts and the electrode sections. Accordingly, no labor hour is required, the printed board can be protected at low cost, and the parts can also be removed after the assembly of the printed board. |
format | Patent |
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CONSTITUTION:When an electronic part is mounted to a printed board, parts 3 for insulation having reflow pads having the same shape as chip parts are mounted and soldered to pads previously shaped at the four ends of the printed board as well as other chip parts. Consequently, since the height of the parts 3 for insulation is made higher than that of the electronic parts 4 mounted to the printed board and electrode sections 5 exposed from the printed board, the parts 3 support the printed board, and protect the electronic parts and the electrode sections. Accordingly, no labor hour is required, the printed board can be protected at low cost, and the parts can also be removed after the assembly of the printed board.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920414&DB=EPODOC&CC=JP&NR=H04112597A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920414&DB=EPODOC&CC=JP&NR=H04112597A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRAMATSU KATSUHIRO</creatorcontrib><title>PROTECTIVE SYSTEM OF PRINTED BOARD</title><description>PURPOSE:To protect a printed board simply, and to remove parts even after assembly by mounting the part for insulation having a reflow pad higher than the part mounted to the printed board or an exposed electrode section and having the same shape as a chip part. CONSTITUTION:When an electronic part is mounted to a printed board, parts 3 for insulation having reflow pads having the same shape as chip parts are mounted and soldered to pads previously shaped at the four ends of the printed board as well as other chip parts. Consequently, since the height of the parts 3 for insulation is made higher than that of the electronic parts 4 mounted to the printed board and electrode sections 5 exposed from the printed board, the parts 3 support the printed board, and protect the electronic parts and the electrode sections. 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CONSTITUTION:When an electronic part is mounted to a printed board, parts 3 for insulation having reflow pads having the same shape as chip parts are mounted and soldered to pads previously shaped at the four ends of the printed board as well as other chip parts. Consequently, since the height of the parts 3 for insulation is made higher than that of the electronic parts 4 mounted to the printed board and electrode sections 5 exposed from the printed board, the parts 3 support the printed board, and protect the electronic parts and the electrode sections. Accordingly, no labor hour is required, the printed board can be protected at low cost, and the parts can also be removed after the assembly of the printed board.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng |
recordid | cdi_epo_espacenet_JPH04112597A |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | PROTECTIVE SYSTEM OF PRINTED BOARD |
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