COMPONENT MOUNTING DEVICE

COMPONENT MOUNTING DEVICE

PURPOSE:To permit the operation of a positioning part to be harmonized with the operation of a mounting head and shorten the operation tactic by moving the positioning part and the mounting head by a specific operation method. CONSTITUTION:When mounting a flat pack IC 2, a positioning part 120 moves...

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1. Verfasser: KINO MIKIO
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator KINO MIKIO
description PURPOSE:To permit the operation of a positioning part to be harmonized with the operation of a mounting head and shorten the operation tactic by moving the positioning part and the mounting head by a specific operation method. CONSTITUTION:When mounting a flat pack IC 2, a positioning part 120 moves to a component receiving position 122 first. Then, a supplying head 100 drops the flat pack IC 2 at the positioning part 120. The positioning part 120 which received the flat pack IC 2 moves to a component delivering position 123 and aligns the flat pack IC 2 on the way. A mounting head 30 picks up the flat pack IC 2 from the positioning part 120 stopped at the component delivering position 123. At that time, the 'previous positioning' of the component is performed by the preceding program step and when the component picked up from the positioning part is mismounted, the recovery mounting of the mismounted component is performed after the component of the subsequent step is mounted when a component of the subsequent step is previously taken in the positioning part.
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CONSTITUTION:When mounting a flat pack IC 2, a positioning part 120 moves to a component receiving position 122 first. Then, a supplying head 100 drops the flat pack IC 2 at the positioning part 120. The positioning part 120 which received the flat pack IC 2 moves to a component delivering position 123 and aligns the flat pack IC 2 on the way. A mounting head 30 picks up the flat pack IC 2 from the positioning part 120 stopped at the component delivering position 123. At that time, the 'previous positioning' of the component is performed by the preceding program step and when the component picked up from the positioning part is mismounted, the recovery mounting of the mismounted component is performed after the component of the subsequent step is mounted when a component of the subsequent step is previously taken in the positioning part.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1992</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19920402&amp;DB=EPODOC&amp;CC=JP&amp;NR=H04101500A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19920402&amp;DB=EPODOC&amp;CC=JP&amp;NR=H04101500A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KINO MIKIO</creatorcontrib><title>COMPONENT MOUNTING DEVICE</title><description>PURPOSE:To permit the operation of a positioning part to be harmonized with the operation of a mounting head and shorten the operation tactic by moving the positioning part and the mounting head by a specific operation method. CONSTITUTION:When mounting a flat pack IC 2, a positioning part 120 moves to a component receiving position 122 first. Then, a supplying head 100 drops the flat pack IC 2 at the positioning part 120. The positioning part 120 which received the flat pack IC 2 moves to a component delivering position 123 and aligns the flat pack IC 2 on the way. A mounting head 30 picks up the flat pack IC 2 from the positioning part 120 stopped at the component delivering position 123. At that time, the 'previous positioning' of the component is performed by the preceding program step and when the component picked up from the positioning part is mismounted, the recovery mounting of the mismounted component is performed after the component of the subsequent step is mounted when a component of the subsequent step is previously taken in the positioning part.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1992</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB09vcN8Pdz9QtR8PUP9Qvx9HNXcHEN83R25WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgYmhgaGpgYGjsbEqAEAIu4gLA</recordid><startdate>19920402</startdate><enddate>19920402</enddate><creator>KINO MIKIO</creator><scope>EVB</scope></search><sort><creationdate>19920402</creationdate><title>COMPONENT MOUNTING DEVICE</title><author>KINO MIKIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH04101500A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1992</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KINO MIKIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KINO MIKIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPONENT MOUNTING DEVICE</title><date>1992-04-02</date><risdate>1992</risdate><abstract>PURPOSE:To permit the operation of a positioning part to be harmonized with the operation of a mounting head and shorten the operation tactic by moving the positioning part and the mounting head by a specific operation method. CONSTITUTION:When mounting a flat pack IC 2, a positioning part 120 moves to a component receiving position 122 first. Then, a supplying head 100 drops the flat pack IC 2 at the positioning part 120. The positioning part 120 which received the flat pack IC 2 moves to a component delivering position 123 and aligns the flat pack IC 2 on the way. A mounting head 30 picks up the flat pack IC 2 from the positioning part 120 stopped at the component delivering position 123. At that time, the 'previous positioning' of the component is performed by the preceding program step and when the component picked up from the positioning part is mismounted, the recovery mounting of the mismounted component is performed after the component of the subsequent step is mounted when a component of the subsequent step is previously taken in the positioning part.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title COMPONENT MOUNTING DEVICE
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