ADHESIVE COMPOSITION FOR STICKING FOIL
PURPOSE:To provide the title flame-retardant composition excellent in fluidity, adhesivity, soldering heat resistance, flexibility, etc., comprising each specific epoxy resin mixture and acrylonitrile/butadiene copolymer and an epoxy-curing agent at specified proportion. CONSTITUTION:The objective c...
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| creator | NEMOTO YOUSUI ITOU AKIYOSHI |
| description | PURPOSE:To provide the title flame-retardant composition excellent in fluidity, adhesivity, soldering heat resistance, flexibility, etc., comprising each specific epoxy resin mixture and acrylonitrile/butadiene copolymer and an epoxy-curing agent at specified proportion. CONSTITUTION:The objective composition containing 10-30wt.% of bromine, comprising (A) 100 pts.wt. of a mixture of (1) 5-50wt.% of an epoxy resin of the formula and (2) a second epoxy resin having in the molecule bromine atom, (B) 20-70 pts.wt. of an acrylonitrile/butadiene copolymer having in the molecule carboxyl group and solid at normal temperature and (C) an epoxy-curing agent. |
| format | Patent |
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CONSTITUTION:The objective composition containing 10-30wt.% of bromine, comprising (A) 100 pts.wt. of a mixture of (1) 5-50wt.% of an epoxy resin of the formula and (2) a second epoxy resin having in the molecule bromine atom, (B) 20-70 pts.wt. of an acrylonitrile/butadiene copolymer having in the molecule carboxyl group and solid at normal temperature and (C) an epoxy-curing agent.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910114&DB=EPODOC&CC=JP&NR=H037791A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910114&DB=EPODOC&CC=JP&NR=H037791A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NEMOTO YOUSUI</creatorcontrib><creatorcontrib>ITOU AKIYOSHI</creatorcontrib><title>ADHESIVE COMPOSITION FOR STICKING FOIL</title><description>PURPOSE:To provide the title flame-retardant composition excellent in fluidity, adhesivity, soldering heat resistance, flexibility, etc., comprising each specific epoxy resin mixture and acrylonitrile/butadiene copolymer and an epoxy-curing agent at specified proportion. 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CONSTITUTION:The objective composition containing 10-30wt.% of bromine, comprising (A) 100 pts.wt. of a mixture of (1) 5-50wt.% of an epoxy resin of the formula and (2) a second epoxy resin having in the molecule bromine atom, (B) 20-70 pts.wt. of an acrylonitrile/butadiene copolymer having in the molecule carboxyl group and solid at normal temperature and (C) an epoxy-curing agent.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSITION FOR STICKING FOIL |
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