BONDING METHOD OF POLYOLEFIN-RESIN MOLDING
PURPOSE:To obtain excellent adhesive properties without executing special surface modifying treatment by holding a polyolefin rein swollen or gelled by a dielectrically heatable organic solvent between polyolefin-resin molding and irradiating the polyolefin resin with microwaves. CONSTITUTION:A subs...
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| creator | FUJIMATSU HITOSHI |
| description | PURPOSE:To obtain excellent adhesive properties without executing special surface modifying treatment by holding a polyolefin rein swollen or gelled by a dielectrically heatable organic solvent between polyolefin-resin molding and irradiating the polyolefin resin with microwaves. CONSTITUTION:A substance acquired by treating a polyolefin resin with a dielectrically heatable organic solvent into a swollen or gelled resin is used as adhesives. The swollen or gelled polyolefin resin is held between polyolefin moldings to be bonded. The polyolefin resin is held in such a manner that sheet-shaped swollen polyolefin is interposed, or gelled polyolefin is applied, and the polyolefin moldings are laminated or abutted and load application, temporary fixing, etc. are conducted as required. A joining section is irradiated with microwaves. Microwaves having frequency from 300MHz to 30GHz and an output of approximately 0.5-10kW can be used for the irradiation of microwaves, and the irradiation time is brought to approximately several sec or ten min normally. Accordingly, surface treating operation is also unnecessitated, and high adhesive strength can be acquired by employing a simple heating facility. |
| format | Patent |
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CONSTITUTION:A substance acquired by treating a polyolefin resin with a dielectrically heatable organic solvent into a swollen or gelled resin is used as adhesives. The swollen or gelled polyolefin resin is held between polyolefin moldings to be bonded. The polyolefin resin is held in such a manner that sheet-shaped swollen polyolefin is interposed, or gelled polyolefin is applied, and the polyolefin moldings are laminated or abutted and load application, temporary fixing, etc. are conducted as required. A joining section is irradiated with microwaves. Microwaves having frequency from 300MHz to 30GHz and an output of approximately 0.5-10kW can be used for the irradiation of microwaves, and the irradiation time is brought to approximately several sec or ten min normally. Accordingly, surface treating operation is also unnecessitated, and high adhesive strength can be acquired by employing a simple heating facility.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; GENERAL PROCESSES OF COMPOUNDING ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL ; WORKING-UP</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910325&DB=EPODOC&CC=JP&NR=H0369342A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910325&DB=EPODOC&CC=JP&NR=H0369342A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJIMATSU HITOSHI</creatorcontrib><title>BONDING METHOD OF POLYOLEFIN-RESIN MOLDING</title><description>PURPOSE:To obtain excellent adhesive properties without executing special surface modifying treatment by holding a polyolefin rein swollen or gelled by a dielectrically heatable organic solvent between polyolefin-resin molding and irradiating the polyolefin resin with microwaves. CONSTITUTION:A substance acquired by treating a polyolefin resin with a dielectrically heatable organic solvent into a swollen or gelled resin is used as adhesives. The swollen or gelled polyolefin resin is held between polyolefin moldings to be bonded. The polyolefin resin is held in such a manner that sheet-shaped swollen polyolefin is interposed, or gelled polyolefin is applied, and the polyolefin moldings are laminated or abutted and load application, temporary fixing, etc. are conducted as required. A joining section is irradiated with microwaves. Microwaves having frequency from 300MHz to 30GHz and an output of approximately 0.5-10kW can be used for the irradiation of microwaves, and the irradiation time is brought to approximately several sec or ten min normally. 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CONSTITUTION:A substance acquired by treating a polyolefin resin with a dielectrically heatable organic solvent into a swollen or gelled resin is used as adhesives. The swollen or gelled polyolefin resin is held between polyolefin moldings to be bonded. The polyolefin resin is held in such a manner that sheet-shaped swollen polyolefin is interposed, or gelled polyolefin is applied, and the polyolefin moldings are laminated or abutted and load application, temporary fixing, etc. are conducted as required. A joining section is irradiated with microwaves. Microwaves having frequency from 300MHz to 30GHz and an output of approximately 0.5-10kW can be used for the irradiation of microwaves, and the irradiation time is brought to approximately several sec or ten min normally. Accordingly, surface treating operation is also unnecessitated, and high adhesive strength can be acquired by employing a simple heating facility.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPH0369342A |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP |
| title | BONDING METHOD OF POLYOLEFIN-RESIN MOLDING |
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