MODIFIED PHENOLIC RESIN

PURPOSE:To obtain a modified phenolic resin having a specific softening point by mixing phenol with a specific aromatic hydrocarbon formaldehyde resin at a specific ratio, reacting the components in the presence of an acid catalyst, adding specific amounts of formaldehyde and an alkaline catalyst an...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ONUMA YASUSHI, YAMAGISHI KAZUYOSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ONUMA YASUSHI
YAMAGISHI KAZUYOSHI
description PURPOSE:To obtain a modified phenolic resin having a specific softening point by mixing phenol with a specific aromatic hydrocarbon formaldehyde resin at a specific ratio, reacting the components in the presence of an acid catalyst, adding specific amounts of formaldehyde and an alkaline catalyst and reacting under refluxing. CONSTITUTION:The objective modified phenolic resin has a softening point of 65-85 deg.C and excellent heat resistance, moisture-resistance and electrical properties and is suitable as a binder for reinforced material. It can be produced by mixing 100 pts.wt. of phenol with 10-70 pts.wt. of an aromatic hydrocarbon formaldehyde resin containing =14mol/kg, reacting the components with each other in the presence of an acid catalyst (preferably p-toluenesulfonic acid), adding 25-55 pts.wt. of formaldehyde and an alkaline catalyst (preferably sodium hydroxide, etc.), reacting under refluxing and distilling off the unreacted components under reduced pressure.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0352915A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0352915A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0352915A3</originalsourceid><addsrcrecordid>eNrjZBD39XfxdPN0dVEI8HD18_fxdFYIcg329ONhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GxqZGloamjsZEKAEAlS8fJA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MODIFIED PHENOLIC RESIN</title><source>esp@cenet</source><creator>ONUMA YASUSHI ; YAMAGISHI KAZUYOSHI</creator><creatorcontrib>ONUMA YASUSHI ; YAMAGISHI KAZUYOSHI</creatorcontrib><description>PURPOSE:To obtain a modified phenolic resin having a specific softening point by mixing phenol with a specific aromatic hydrocarbon formaldehyde resin at a specific ratio, reacting the components in the presence of an acid catalyst, adding specific amounts of formaldehyde and an alkaline catalyst and reacting under refluxing. CONSTITUTION:The objective modified phenolic resin has a softening point of 65-85 deg.C and excellent heat resistance, moisture-resistance and electrical properties and is suitable as a binder for reinforced material. It can be produced by mixing 100 pts.wt. of phenol with 10-70 pts.wt. of an aromatic hydrocarbon formaldehyde resin containing &lt;=5wt.% of diarylmethane component and having a xylenol value of &gt;=14mol/kg, reacting the components with each other in the presence of an acid catalyst (preferably p-toluenesulfonic acid), adding 25-55 pts.wt. of formaldehyde and an alkaline catalyst (preferably sodium hydroxide, etc.), reacting under refluxing and distilling off the unreacted components under reduced pressure.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19910307&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0352915A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19910307&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0352915A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ONUMA YASUSHI</creatorcontrib><creatorcontrib>YAMAGISHI KAZUYOSHI</creatorcontrib><title>MODIFIED PHENOLIC RESIN</title><description>PURPOSE:To obtain a modified phenolic resin having a specific softening point by mixing phenol with a specific aromatic hydrocarbon formaldehyde resin at a specific ratio, reacting the components in the presence of an acid catalyst, adding specific amounts of formaldehyde and an alkaline catalyst and reacting under refluxing. CONSTITUTION:The objective modified phenolic resin has a softening point of 65-85 deg.C and excellent heat resistance, moisture-resistance and electrical properties and is suitable as a binder for reinforced material. It can be produced by mixing 100 pts.wt. of phenol with 10-70 pts.wt. of an aromatic hydrocarbon formaldehyde resin containing &lt;=5wt.% of diarylmethane component and having a xylenol value of &gt;=14mol/kg, reacting the components with each other in the presence of an acid catalyst (preferably p-toluenesulfonic acid), adding 25-55 pts.wt. of formaldehyde and an alkaline catalyst (preferably sodium hydroxide, etc.), reacting under refluxing and distilling off the unreacted components under reduced pressure.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD39XfxdPN0dVEI8HD18_fxdFYIcg329ONhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GxqZGloamjsZEKAEAlS8fJA</recordid><startdate>19910307</startdate><enddate>19910307</enddate><creator>ONUMA YASUSHI</creator><creator>YAMAGISHI KAZUYOSHI</creator><scope>EVB</scope></search><sort><creationdate>19910307</creationdate><title>MODIFIED PHENOLIC RESIN</title><author>ONUMA YASUSHI ; YAMAGISHI KAZUYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0352915A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1991</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>ONUMA YASUSHI</creatorcontrib><creatorcontrib>YAMAGISHI KAZUYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ONUMA YASUSHI</au><au>YAMAGISHI KAZUYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MODIFIED PHENOLIC RESIN</title><date>1991-03-07</date><risdate>1991</risdate><abstract>PURPOSE:To obtain a modified phenolic resin having a specific softening point by mixing phenol with a specific aromatic hydrocarbon formaldehyde resin at a specific ratio, reacting the components in the presence of an acid catalyst, adding specific amounts of formaldehyde and an alkaline catalyst and reacting under refluxing. CONSTITUTION:The objective modified phenolic resin has a softening point of 65-85 deg.C and excellent heat resistance, moisture-resistance and electrical properties and is suitable as a binder for reinforced material. It can be produced by mixing 100 pts.wt. of phenol with 10-70 pts.wt. of an aromatic hydrocarbon formaldehyde resin containing &lt;=5wt.% of diarylmethane component and having a xylenol value of &gt;=14mol/kg, reacting the components with each other in the presence of an acid catalyst (preferably p-toluenesulfonic acid), adding 25-55 pts.wt. of formaldehyde and an alkaline catalyst (preferably sodium hydroxide, etc.), reacting under refluxing and distilling off the unreacted components under reduced pressure.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPH0352915A
source esp@cenet
subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
title MODIFIED PHENOLIC RESIN
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T19%3A11%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ONUMA%20YASUSHI&rft.date=1991-03-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH0352915A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true